New Research Could Trigger Revolution in Computer Electronics Manufacturing
March 3, 2017 | University of ExeterEstimated reading time: 1 minute
A pioneering new technique to produce cutting-edge, versatile microchips could revolutionize the speed, efficiency and capability of the next generation of computers.
Researchers from the University of Exeter have developed an innovative new method to engineer computer chips more easily and cheaper than conventional methods.
The discovery could revolutionise the production of optoelectronic materials – or devices that produce, detect and control light – which are vital to the next generation of renewable energy, security and defence technologies, the researchers said.
Dr Anna Baldycheva, from Exeter’s Centre for Graphene Science and author of the paper said:"This breakthrough will hopefully lead to a revolution in the development of vital new materials for computer electronics. The work provides a solid platform for the development of novel next-generation optoelectronic devices. Additionally, the materials and methods used are extremely promising for a wide range of further potential applications beyond the current devices."
The innovative new research focused on developing a versatile, multi-functional technology to significantly enhance future computing capabilities.
The team used microfluidics technology, which uses a series of minuscule channels in order to control the flow and direction of tiny amounts of fluid. For this research, the fluid contains graphene oxide flakes,that are mixed together in the channels, to construct the chips.
While the graphene oxide flakes are two-dimensional- consisting of length and width only- the research team used a new sophisticated light-based system to drive the assembly of the three-dimensional chip structures.
Crucially, the research team have analysed their methodology to not only confirm the technique is successful, but also to provide a blueprint for others to use to help manufacture the chips.
Suggested Items
LQDX Divests Aluminum Soldering Business - Mina™ - to Taiyo America Inc.
05/02/2024 | PRNewswireLQDX, formerly known as Averatek Corp., developer of high-performance materials for advanced semiconductor manufacturing, today announced that it has divested its aluminum soldering business – known as MinaTM – to Taiyo America Inc., a global market leader in advanced electronic materials.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Real Time with... IPC APEX EXPO 2024: Adhesive Materials and Equipment Update with Dymax
05/01/2024 | Real Time with...IPC APEX EXPOVirginia Hogan, global business development manager at Dymax, discusses adhesive materials, dispensing and curing equipment, a new, high-reliability conformal coating, and various materials and dispensing methods.
Real Time with... IPC APEX EXPO 2024: Sustainability in the Industry
04/26/2024 | Real Time with...IPC APEX EXPOGuest Editor Henry Crandall and Chris Nash of Indium Corporation discuss the company's 90th anniversary and its focus on sustainability. They focus on the benefits of sustainable materials, their compatibility, and value propositions. The conversation also highlights how Durafuse LT technology's role in reducing reflow temperatures is leading to significant cost and energy savings. Nash also touches on downstream sustainability efforts such as using recycled materials for packaging.
SMC Korea 2024 to Highlight Semiconductor Materials Trends and Innovations on Industry’s Path to $1 Trillion
04/24/2024 | SEMIWith Korea a major consumer of semiconductor materials and advanced materials a key driver of innovation on the industry’s path to $1 trillion, industry leaders and experts will gather at SMC (Strategic Materials Conference) Korea 2024 on May 29 at the Suwon Convention Center in Gyeonggi-do, South Korea to provide insights into the latest materials developments and trends. Registration is open.