-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Legislative Outlook: Helping or Hurting?
This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
HON-Flex Chooses InCAM Flex as its Leading CAM Solution
March 9, 2017 | OrbotechEstimated reading time: 2 minutes
Orbotech Ltd. has announced that HON-Flex has chosen InCAM Flex as its preproduction CAM solution. Developed by Frontline PCB Solutions, InCAM Flex is a dedicated industry-leading, field-proven preproduction CAM solution, for flex and rigid-flex PCB makers that provides precise CAM tooling and production data optimization via flex design for manufacturing tools.
“Since migrating from GenFlex to InCAM Flex, we significantly improved our efficiency and production quality, expnding our competitive advantage,” said Mr. Brad Chang, Design Director at HON-Flex. “InCAM Flex’s large scale automation capabilities enables us to process more complex files, lower maintenance costs, and cut errors and CAM processing time. Scale and Stretch has increased our productivity by allowing us to scale connectors and stretch the connecting traces faster than before. We’ve also noticed quality improvements since using Advanced Etch Compensation, which performs smoother compensation while eliminating the need to manually repair compensated data.”
“We are delighted that HON-Flex has migrated to InCAM Flex,” said Walter Hsu, PSP Director in Orbotech Pacific. “InCAM Flex was designed to help PCB manufacturers meet the increasing challenges of a rapidly growing flex PCB market by optimizing their flex production processes. The substantial improvements that HON-Flex is already experiencing in their production process are testament to our abilities to provide the right solutions at the right time.”
About InCAM Flex
InCAM Flex provides fast, high-precision CAM tooling for flex and rigid-flex manufacturers and enables automatic production data optimization via flex design for manufacturing tools. Combined with powerful flex CAD tools and automatic flex board panelization, InCAM Flex brings with it benefits that are most important for businesses, increasing yields and achieving faster job turnaround. In addition, InCAM Flex seamlessly integrates and shares information with InPlan®Flex Engineering Suite, design and assembly via ODB++, and has a streamlined user interface.
About HON-Flex
Founded in 2003, Xiamen Hongxin Electron-tech Co., Ltd., specializes in the R&D, design, manufacture and sale of flexible printed circuit boards (FPC). Nurtured by the successful Hongxin Entrepreneur Incubator, HON-Flex focuses on producing high-precision FPCs for the mobile communications and consumer electronics industries. HON-Flex has strategic alliances with leading electronics companies both at home and abroad. In 2013, HON-Flex was ranked as the number one player in the China FPC industry. HON-Flex strives to be a world leader in the FPC industry and to realize its mission to: Establish a business to serve the country. Develop a business to strengthen the country.
About Orbotech
Orbotech Ltd. is a global innovator of enabling technologies used in the manufacture of the world’s most sophisticated consumer and industrial products throughout the electronics and adjacent industries. The Company is a leading provider of yield enhancement and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems and other electronic components.
Virtually every electronic device is produced using Orbotech technology. For more information visit www.orbotech.com.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
NOVOSENSE, UAES and Innoscience Advance Power Electronics for New Energy Vehicles
10/17/2025 | PRNewswireThe partnership focuses on developing next-generation intelligent integrated Gallium Nitride (GaN) products. Leveraging their combined expertise, the new devices will deliver more reliable GaN driving and protection features, enabling higher power density and paving the way for wider adoption in automotive systems.
Jabil Announces Board Transitions
10/17/2025 | JabilJabil Inc. announced that Executive Chairman of the Board of Directors Mark T. Mondello and Directors Kathleen A. Walters and Jamie Siminoff will not seek re-election at Jabil’s Annual Meeting of Stockholders in January 2026.
StenTech Strengthens Precision Parts Platform with AME Acquisition
10/17/2025 | StenTechStenTech, North America’s leading provider of SMT printing solutions and precision manufacturing, has announced the acquisition of Advanced Metal Etching, Inc. (AME), a recognized specialist in chemically etched and laser cut precision parts.
MKS’ Atotech, ESI to Participate in TPCA Show & IMPACT Conference 2025
10/17/2025 | MKS’ AtotechMKS Inc., a global provider of enabling technologies that transform our world, announced that its strategic brands Atotech (process chemicals, equipment, software, and services) and ESI (laser systems) will showcase their latest range of leading manufacturing solutions for printed circuit board (PCB) and package substrate manufacturing at the upcoming 26th TPCA Show 2025 to be held at the Taipei Nangang Exhibition Center from 22-24 October 2025.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.