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RTW IPC APEX EXPO: Orbotech Tackles Next-Gen Interconnection Density
March 13, 2017 | Real Time with...IPCEstimated reading time: Less than a minute
Orbotech West President Sharon Cohen explains the company structure and philosophy—translating ideas into reality - and how, by understanding the issues driving PCB technology, Orbotech is able to provide the imaging and inspection tools to meet the needs of next-generation interconnection density.
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