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March 14, 2017 | OrbotechEstimated reading time: 1 minute
Orbotech Ltd. has announced that a major Japanese electronics manufacturer with worldwide facilities, placed a $5 million order of multiple direct imaging (DI) solutions for solder mask and other solutions. The Orbotech solutions were adapted to meet the customer’s specific manufacturing requirements for smart mobile devices.
Following extensive testing in late 2016 and strong collaboration between Orbotech and its customer, Orbotech received an order for multiple direct imaging solutions to address the technological challenges involved in manufacturing next generation smart mobile devices. Orbotech installed the Paragon Ultra delivering superior imaging accuracy and yields for the industry’s most complex IC substrates. In addition, the Nuvogo™ 1000R, Orbotech’s large-format DI solution, was also installed enabling consistent high-quality DI for both patterning and solder mask at unmatched speed and yield.
“Our customer had specific demands regarding production standards and specifications that presented unique challenges,” stated Mr. Yair Alcobi, President of Orbotech Asia East. “In addition to our systems’ high throughput and extreme accuracy, Orbotech succeeded in customizing features to satisfy the specific requirements of a number of advanced applications.”
About Orbotech Ltd.
Orbotech Ltd. is a global innovator of enabling technologies used in the manufacture of the world’s most sophisticated consumer and industrial products throughout the electronics and adjacent industries. The Company is a leading provider of yield enhancement, and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems (MEMS), LED, high speed RF on GaAs, power management device and other electronic components. Today, virtually every electronic device in the world is produced using Orbotech systems. For more information, visit www.orbotech.com..
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