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Zhen Ding Technology Holding Co., Ltd., a global leader in the PCB industry, returned to exhibit at SEMICON Taiwan 2025. Positioning itself as an industry pioneer in "PCB expanding into semiconductors," the company showcased its latest strategic layout. Zhen Ding stated that this exhibition is not only a concrete demonstration of its R&D achievements but also a declaration of its industry status, symbolizing the company’s evolution from a PCB leader to a key driver in the semiconductor industry chain, injecting continuous momentum into the development of AI applications.
Chairman Charles Shen pointed out that the world is in a critical era of explosive data growth and surging computing power. According to the latest Heterogeneous Computing Power Synergy White Paper released by the Global Computing Alliance, the global computing power scale reached 615 E FLOPS in 2021 and is expected to grow to 56 Z FLOPS by 2030, with a high Compound Annual Growth Rate (CAGR) of 65.1%. This clearly shows that computing power has become the core engine driving industrial development. He emphasized that AI is a crucial driver for the growth of the PCB industry. As semiconductor processes continue to advance, PCBs assume the critical task of supporting high- performance applications. The technologies Zhen Ding exhibited at SEMICON—including 28-layer high-end substrates, extra-large substrates of 138x138mm, and HLC+HDI solutions specifically designed for AI servers—are all responses to the market’s urgent demand for high-speed transmission and high-performance computing.
With the increasing complexity of chips and the popularization of 3D packaging, PCB is no longer merely a circuit carrier, but a critical link determining whether computing power can be fully unleashed. In particular, many AI applications impose stringent requirements on PCBs, such as high frequency, high speed, high density, high reliability, and low energy consumption. A single manufacturing process can hardly meet these demands; thus, integrating different processes—including high-end IC substrates, high-end HDI/MSAP substrates, and HLC thick large boards—has become the key to achieving performance breakthroughs. Centering on the "One ZDT" strategy, Zhen Ding will fully deploy "cloud, pipe, and device" applications in the AI era, provide customers with the most comprehensive solutions, and leverage its advantage in the vertical integration layout of the full AI PCB product line to continuously widen the leading gap with competitors in the AI era.
Beyond forward-looking technological layout, Zhen Ding is also actively advancing AI smart manufacturing and green digital transformation. Through cooperation with Advantech (Stock Code: 2395), a leader in the industrial IoT industry, Zhen Ding has achieved multi- faceted results in digital transformation. It has now adopted Advantech’s energy management platform, and Advantech has also shared solutions and implementation experience related to smart parks and carbon management platforms. These achievements not only enhance energy conservation and carbon reduction efforts but also reflect Zhen Ding’s commitment to sustainable ESG practices.
Advantech Chairman KC Liu said, "As a leader in the PCB industry, Zhen Ding is also our long-term key partner. We are honored to join hands with Zhen Ding to promote the digitalization, intelligent transformation, and green transition of PCB manufacturing. Starting from early cooperation in data visualization and energy management, we have gradually expanded to more comprehensive smart factory applications. In the future, Advantech will continue to share experience in applying AI technology at its Linkou and Kunshan factories and explore collaboration with Zhen Ding on production line Edge AI and AI Agents. I believe this in-depth cooperation will not only set a new model for smart and green manufacturing but also bring long-term value to the entire industry."
Looking ahead, Zhen Ding will continue to focus on the "One ZDT" strategy, integrate global resources and R&D capabilities, and expand its dual-domain layout in both PCB and semiconductors. Zhen Ding stated that PCB’s entry into the semiconductor field not only marks an important milestone for the company itself but also serves as a key opportunity to drive the upgrading of the entire PCB industry. As a global PCB leader and a pioneer in expanding into semiconductors, Zhen Ding will continue to take the lead in guiding the electronics industry into a new era.
