-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
EIPC SpeedNews: News from the European PCB Industry
April 13, 2017 | EIPCEstimated reading time: Less than a minute

News from the EIPC
Registration Now Open for EIPC Summer Conference Birmingham, June 1–2, 2017
- Atotech to Present its Chemistry and Equipment Solutions at the KPCA 2017
- Contamination, Cleaning and Coating Conference, May 22–24, 2017
- ICT 43rd Annual Symposium at the Black Country Museum
- A Low-Cost Event (Free for Members) in Bristol on April 25
- What's New in Electronics Live Expo at The NEC, May 9–10
News from SMT Hybrid & Packaging
- Visit the EIPC Stand at Hall 5-325
- SMT Hybrid Packaging 2017: Numerous Highlights in New Halls
- Pickering Interfaces to Showcase Latest Switching & Simulation Solutions at SMT Hybrid Packaging 2017
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/20/2025 | Andy Shaughnessy, I-Connect007It’s been a busy week in this industry, and we have news and articles from the PCB design, fabrication and assembly communities. Some of this news is out of this world. We may be losing the high ground—the really high ground. Columnist Jesse Vaughan explains how the U.S. seems to be falling behind in space, and how this could affect our ability to defend ourselves in the future. We have an update on the U.S.-China tariff talks, which seem to be moving forward, though sometimes at a snail’s pace.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
EIPC Summer Conference 2025: PCB Innovation in Edinburgh
04/18/2025 | EIPCEIPC have very wisely selected this wonderful city in Scotland as the venue for their Summer Conference on June 3-4. Whilst delegates will be distilling the proven information imparted by the speakers in the day, in the evening they will be free spirits at the Conference Dinner.
EIPC Summer Conference 2025: Call for Distinguished Speakers in Edinburgh
03/26/2025 | EIPCThe European Institute of Printed Circuits (EIPC) is pleased to announce its Summer Conference 2025, scheduled for June 3-4 in the historic city of Edinburgh, Scotland.
EIPC Winter Conference to Explore Latest Trends in Electronics Manufacturing
12/31/2024 | EIPCThe European Printed Circuit Association (EIPC) is pleased to announce its upcoming Winter Conference, scheduled for February 4-5, 2025, at the DoubleTree by Hilton Hotel in Luxembourg City.