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IMAPS and DPC: 21 Years of Elevating Technical Knowledge

03/13/2025 | Marcy LaRont, I-Connect007
The IMAPS 21st Device Packaging Conference (DPC) may have taken place at a conference center located down an idyllic desert road showcasing the best of what native Arizona has to offer, but the topics at this conference were anything but laid-back. This important platform for professionals in microelectronics and advanced packaging set the stage for a technology in high demand. Brian Schieman, IMAPS executive director, says the show was organized to demonstrate their commitment to addressing current technological trends and with significant energy directed toward fostering connections within the supply chain.

TPCA Thailand PCB Talent Matchmaking Conference Successfully Connects Industry and Academia

03/10/2025 | TPCA
The Taiwan Printed Circuit Association (TPCA) recently concluded its "International PCB Talent Matchmaking Conference" in Bangkok, Thailand, on March 5, 2025.

SEMICON China 2025 to Highlight Key Opportunities and Challenges in Advancing Semiconductor Industry Growth

03/07/2025 | SEMI
SEMICON China 2025 will gather industry visionaries and leaders from March 26-28 at the Shanghai New International Expo Centre to delve into the latest developments, trends, and innovations in key areas crucial for propelling industry growth to $1 trillion by 2030.

2025 IEEE Electronic Components and Technology Conference

03/04/2025 | IEEE
More than 2,000 scientists, engineers and businesspeople are expected to attend the 75th annual IEEE Electronic Components and Technology Conference (ECTC) from May 27-30, 2025 at the Gaylord Texan Resort & Convention Center here.

Best Technical Papers at IPC APEX EXPO 2025 Selected

03/03/2025 | IPC
The best technical conference papers of IPC APEX EXPO 2025 have been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Conference Program Committee (TPC), the international group of paper authors will be recognized during show opening remarks on Tuesday, March 18.
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