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For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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EIPC Winter Conference to Explore Latest Trends in Electronics Manufacturing
December 31, 2024 | EIPCEstimated reading time: Less than a minute
The European Printed Circuit Association (EIPC) is pleased to announce its upcoming Winter Conference, scheduled for February 4-5, 2025, at the DoubleTree by Hilton Hotel in Luxembourg City.
Over the two days the conference itself will cover an eclectic range of topics, including AI, a look at the car of the future, as well as a view of the business outlook for the industry. Plasma jet, manufacturing efficiency, new metallic finishes all get a look-in, delivered by many familiar faces.
The conference will also include a "Quick Fire Walk-In" session on Wednesday afternoon, focusing on standardization, sustainability, quality, and reliability.
Following the conference, attendees will have the opportunity to visit Circuit Foil, a leading company in the electronics industry.
Registration is now open. Please contact the EIPC team in The Netherlands to secure your place at this important industry event.
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