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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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EIPC Winter Conference to Explore Latest Trends in Electronics Manufacturing
December 31, 2024 | EIPCEstimated reading time: Less than a minute
The European Printed Circuit Association (EIPC) is pleased to announce its upcoming Winter Conference, scheduled for February 4-5, 2025, at the DoubleTree by Hilton Hotel in Luxembourg City.
Over the two days the conference itself will cover an eclectic range of topics, including AI, a look at the car of the future, as well as a view of the business outlook for the industry. Plasma jet, manufacturing efficiency, new metallic finishes all get a look-in, delivered by many familiar faces.
The conference will also include a "Quick Fire Walk-In" session on Wednesday afternoon, focusing on standardization, sustainability, quality, and reliability.
Following the conference, attendees will have the opportunity to visit Circuit Foil, a leading company in the electronics industry.
Registration is now open. Please contact the EIPC team in The Netherlands to secure your place at this important industry event.
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Call for Abstracts for Third Pan-European Electronics Design Conference
04/30/2026 | Global Electronics AssociationThe German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association are officially opening the Call for Abstracts for the Third Pan-European Electronics Design Conference (PEDC).
PCB Technologies to Exhibit at PCB East 2026
04/23/2026 | PCB Technologies Ltd.Issey Ende, PCB-Technolgies’ VP of Sales and Marketinghas announced that his company will be exhibiting at this year’s PCB East 2026, the premier East Coast conference and exhibition for the electronics design, fabrication, and assembly industry on Wednesday, April 29, 2026, at the DCU Convention Center in Worcester, Massachusetts.
SMTA Ultra HDI Symposium, Day 1: AI at the Core or Out of the Game
04/13/2026 | Marcy LaRont, I-Connect007It was a beautiful 81°F morning in Arizona last Wednesday as I headed to the third annual SMTA Ultra HDI Symposium, focused on AI and ultra high density interconnect technology. Strategically held as part of Arizona’s Tech Week, this year’s conference took place in Avondale in Phoenix's West Valley. The event moved from the cozy offices of the Peoria Sports Complex (which paid homage to baseball’s spring training world) to the larger Avondale Conference Center, highlighting the importance of this area for electronics manufacturing investment.
SMTA's Electronics in Harsh Environments Conference Program Announced
03/27/2026 | SMTASMTA is proud to announce the 2026 Electronics in Harsh Environments Conference, taking place 19-21 May in Amsterdam, Netherlands.
Best Technical Paper Awards Showcased at APEX EXPO 2026
03/02/2026 | Global Electronics AssociationThe Global Electronics Association today announced the recipients of the Best Technical Paper Awards from the Advanced Electronic Packaging Conference at APEX EXPO 2026.