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We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
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EIPC Winter Conference to Explore Latest Trends in Electronics Manufacturing
December 31, 2024 | EIPCEstimated reading time: Less than a minute
The European Printed Circuit Association (EIPC) is pleased to announce its upcoming Winter Conference, scheduled for February 4-5, 2025, at the DoubleTree by Hilton Hotel in Luxembourg City.
Over the two days the conference itself will cover an eclectic range of topics, including AI, a look at the car of the future, as well as a view of the business outlook for the industry. Plasma jet, manufacturing efficiency, new metallic finishes all get a look-in, delivered by many familiar faces.
The conference will also include a "Quick Fire Walk-In" session on Wednesday afternoon, focusing on standardization, sustainability, quality, and reliability.
Following the conference, attendees will have the opportunity to visit Circuit Foil, a leading company in the electronics industry.
Registration is now open. Please contact the EIPC team in The Netherlands to secure your place at this important industry event.
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EIPC Summer Conference 2025: Call for Distinguished Speakers in Edinburgh
03/26/2025 | EIPCThe European Institute of Printed Circuits (EIPC) is pleased to announce its Summer Conference 2025, scheduled for June 3-4 in the historic city of Edinburgh, Scotland.
Electronics in Harsh Environments Conference Program Announced
03/25/2025 | SMTASMTA Europe is proud to announce the 2025 Electronics in Harsh Environments Conference, taking place 20-22 May in Amsterdam, Netherlands. This global conference is a three-day technical event with 27 technical presentations focused on building reliable electronics used in power electronics and harsh environments.
SMTA Announces 2025 Technical Program for Electronics in Harsh Environments Conference
03/25/2025 | SMTAThe highly anticipated Electronics in Harsh Environments Conference, scheduled for May 20-22, 2025, in Amsterdam, Netherlands, has released its comprehensive technical program.
IMAPS and DPC: 21 Years of Elevating Technical Knowledge
03/13/2025 | Marcy LaRont, I-Connect007The IMAPS 21st Device Packaging Conference (DPC) may have taken place at a conference center located down an idyllic desert road showcasing the best of what native Arizona has to offer, but the topics at this conference were anything but laid-back. This important platform for professionals in microelectronics and advanced packaging set the stage for a technology in high demand. Brian Schieman, IMAPS executive director, says the show was organized to demonstrate their commitment to addressing current technological trends and with significant energy directed toward fostering connections within the supply chain.