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Current IssueIt's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
Fueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
Inner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
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EIPC Winter Conference to Explore Latest Trends in Electronics Manufacturing
December 31, 2024 | EIPCEstimated reading time: Less than a minute
The European Printed Circuit Association (EIPC) is pleased to announce its upcoming Winter Conference, scheduled for February 4-5, 2025, at the DoubleTree by Hilton Hotel in Luxembourg City.
Over the two days the conference itself will cover an eclectic range of topics, including AI, a look at the car of the future, as well as a view of the business outlook for the industry. Plasma jet, manufacturing efficiency, new metallic finishes all get a look-in, delivered by many familiar faces.
The conference will also include a "Quick Fire Walk-In" session on Wednesday afternoon, focusing on standardization, sustainability, quality, and reliability.
Following the conference, attendees will have the opportunity to visit Circuit Foil, a leading company in the electronics industry.
Registration is now open. Please contact the EIPC team in The Netherlands to secure your place at this important industry event.
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03/13/2025 | Marcy LaRont, I-Connect007The IMAPS 21st Device Packaging Conference (DPC) may have taken place at a conference center located down an idyllic desert road showcasing the best of what native Arizona has to offer, but the topics at this conference were anything but laid-back. This important platform for professionals in microelectronics and advanced packaging set the stage for a technology in high demand. Brian Schieman, IMAPS executive director, says the show was organized to demonstrate their commitment to addressing current technological trends and with significant energy directed toward fostering connections within the supply chain.
TPCA Thailand PCB Talent Matchmaking Conference Successfully Connects Industry and Academia
03/10/2025 | TPCAThe Taiwan Printed Circuit Association (TPCA) recently concluded its "International PCB Talent Matchmaking Conference" in Bangkok, Thailand, on March 5, 2025.
SEMICON China 2025 to Highlight Key Opportunities and Challenges in Advancing Semiconductor Industry Growth
03/07/2025 | SEMISEMICON China 2025 will gather industry visionaries and leaders from March 26-28 at the Shanghai New International Expo Centre to delve into the latest developments, trends, and innovations in key areas crucial for propelling industry growth to $1 trillion by 2030.
2025 IEEE Electronic Components and Technology Conference
03/04/2025 | IEEEMore than 2,000 scientists, engineers and businesspeople are expected to attend the 75th annual IEEE Electronic Components and Technology Conference (ECTC) from May 27-30, 2025 at the Gaylord Texan Resort & Convention Center here.
Best Technical Papers at IPC APEX EXPO 2025 Selected
03/03/2025 | IPCThe best technical conference papers of IPC APEX EXPO 2025 have been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Conference Program Committee (TPC), the international group of paper authors will be recognized during show opening remarks on Tuesday, March 18.