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LITEON, Elephantech Deepen Partnership to Further Drive Innovation and End-to-End Sustainability

04/24/2025 | LITEON Technology
LITEON Technology has signed a second Memorandum of Understanding (MoU) with Elephantech, deepening their strategic partnership in advancing green Printed Circuit Boards (PCB) manufacturing. Announced on Earth Day (April 22), the renewed collaboration highlights their joint commitment to achieving net-zero carbon emissions.

Transforming the Future of Mobility: DuPont Unveils Silver Nanowire Products in South Korea

04/17/2025 | DuPont
DuPont will showcase its state-of-the-art products that incorporate silver nanowire technologies in Hall D, Booth A31 at Electronics Manufacturing Korea (EMK) and Automotive World Korea (AWK) exhibitions from April 16 to 18.

Nortech Expands Fiber Optic Capabilities to Include MT Connectors, Strengthening Aerospace and Defense Solutions

04/16/2025 | BUSINESS WIRE
Nortech Systems, a trusted leader in innovative connectivity solutions, announced an exciting expansion in its fiber optic capabilities with the integration of MT connectors. MT connectors, known for their ability to support multiple fiber terminations in a compact form factor, are an ideal choice for applications requiring robust data transmission and reliability.

QpiAI Announces Dawn of Quantum Era in India With 25 Qubit Quantum Computer

04/16/2025 | BUSINESS WIRE
QpiAI, a leader in quantum computing and generative AI, announced its First Quantum computer launch code named QpiAI Indus Quantum Computer.

Indium to Feature Materials Solutions Powering Sustainability at PCIM Europe

04/15/2025 | Indium Corporation
Indium Corporation specializes in power device packaging, offering a portfolio of advanced material solutions encompassing the entire assembly, including die-attach, top-side die interconnect, substrate-attach, package-attach, and PCB assembly.
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