Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "

Brent Fischthal - Koh Young

Suggested Items

Global Electronics Association Launches Global Electronics Policy Council to Unite Industry on Trade, Investment, and Supply Chain Policy

05/20/2026 | Global Electronics Association
The Global Electronics Association announced the formation of the Global Electronics Policy Council (GEPC), a new body uniting leading electronics companies from around the world to advance a coordinated policy agenda across every major region of the electronics supply chain.

H2 Core Systems Builds Scalable Hydrogen Energy Solutions with Siemens Xcelerator

05/18/2026 | Siemens
Siemens has announced that H2 Core Systems, a startup focused on modular hydrogen-based energy systems, is using the Siemens Xcelerator platform of software and automation portfolio to design and manufacture compact, highly efficient hydrogen energy systems that generate and store clean energy where it is needed.

What Heterogeneous Integration Means for EMS Providers

05/14/2026 | Nolan Johnson, I-Connect007
Dr. Ravi Mahajan, an Intel Fellow and Director of Intel’s Technology and Pathfinding group, delivered a keynote at the APEX EXPO 2026 technical conference on using heterogeneous integration (HI) as a strategy and on how advanced packaging technology serves as the technical apex for implementing that strategy. Mahajan’s previous papers and industry presentations on such topics as interconnect density, signal integrity, power delivery, thermal path, and assembly yield as system-level constraints confirm him as an expert on package optimization.

SINBON Electronics, Nexcellent Energy Partner on Urban Hydrogen Energy

05/13/2026 | PRNewswire
"We have always believed in working with partners who share the same vision," said Alex Shiung, Business Development Assistant Vice President at SINBON. "Together, we hope to build an ecosystem that is friendly to the environment and beneficial for the planet."

I-Connect007 Announces Upcoming Issue of Advanced Electronics Packaging Digest

05/13/2026 | I-Connect007
The next issue of Advanced Electronics Packaging Digest examines the materials, architectures, and integration strategies shaping the next phase of electronics innovation, from reinforcement materials under thermal and frequency pressure to heterogeneous integration and advanced packaging as a system-level scaling factor.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in