It’s Only Common Sense: Invest in Yourself—You’re Your Most Important Resource
Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
Orbotech at JPCA 2017: Innovative Production Solutions for mSAP, Advanced HDI and Flex
June 9, 2017 | OrbotechEstimated reading time: 5 minutes
Orbotech Ltd., a leading global supplier of yield-enhancing and process-enabling solutions for the manufacture of electronics products, is demonstrating a wide selection of its newest, most innovative, mass production PCB manufacturing solutions for mSAP (modified semi-additive process), advanced HDI and flexible printed circuits at the 2017 JPCA show, June 7-9 in Tokyo Japan.
Among the mSAP enabling innovations Orbotech is presenting at the show are the Orbotech Ultra Fusion 300 AOI solution which now offers new 2D Metrology In-Process Quality Control (IPQC). The company is also demonstrating its Precise 800, the only one-stop AOS solution for opens, nicks & shorts, and Nuvogo Fine 10 DI solution for mSAP, advanced HDI, flexible and rigid PCB patterning. Additionally, the Sprint 200 Flex digital legend inkjet printing solution, optimized for flex multi-panel PCB production, is being shown at the Orbotech booth.
The company is showcasing Orbotech Smart Factory for Industry 4.0 compliant, integrated PCB production. Orbotech Smart Factory, which connects to all Orbotech products, enables real-time production analysis, bi-directional communication and data sharing, enabling traceability and on-demand data analysis. In addition, Orbotech is presenting InCAM Flex, InPlan Flex, InSight PCB, InStack Design and InStack Viewer and its CAM and engineering software solutions for the smart factory.
As a part of the JPCA show’s NPI (New Product Introduction) Seminar, Mr. Kimura Yasushi, Orbotech’s Vice President of Marketing & Products for Japanese Global Accounts will present a session on its Orbotech Smart Factory™ for Industry 4.0. During the seminar, Mr. Yasushi will explain how the new Orbotech Smart Factory solution is truly a partner for Industry 4.0. By self-analyzing and predicting failures and by enabling real-time production analysis, bi-directional communication and traceability, Orbotech Smart Factory helps manufacturers to optimize productivity and responsiveness to production issues.
“Orbotech is proud of our close customer relationships in Asia and of how we continuously work together to deliver leading, accurate solutions for flexible and rigid PCB mass production that help our customers to stay at the forefront of PCB manufacturing,” commented Mr. Yair Alcobi, President of Orbotech Asia East. “The great deal of interest that this market shows in our mSAP solutions and in Orbotech Smart Factory solution is testament to the need for reliable solutions that can significantly improve production processes.”
About Nuvogo Fine 10: Nuvogo Fine 10 is a member of Orbotech’s industry-leading Direct Imaging (DI) solutions for the solutions for the mSAP, advanced HDI & FPC PCB markets. Providing total synergy between Orbotech’s state-of-the-art optics, mechanics and electronics, Nuvogo Fine offers fine resolution (L/S=10/15µm) with superior imaging quality and exceptional throughput. Nuvogo Fine incorporates Orbotech’s field-proven Large Scan Optics (LSO) Technology™, delivering exceptionally high Depth-of-Focus (DoF), and imaging uniformity. It is powered by MultiWave Laser Technology™ which provides optimal resist flexibility.
About Precise 800
The groundbreaking Precise 800 is the first and only ‘one-stop’ Automated Optical Shaping (AOS) solution for mSAP, advanced HDI and complex multi-layer PCB manufacturing market, capable of both ablating excess copper (“shorts”) and depositing missing copper (“opens” and “nicks”), all in a single automated process. Enabling accurate, high quality 3D shaping of the most advanced PCB designs, the Precise 800 significantly increases yield by virtually eliminating PCB scrap. The Precise 800 addresses all defects including those on inner and outer layers, multiple lines, corners and pads.
About Ultra Fusion 300+ 2D Metrology
Ultra Fusion 300 is an mSAP and advanced HDI AOI solution, which is a part of the Orbotech market-leading, high performance AOI family, based on the Multi-Image Technology for superior detection and false-alarm reduction. Orbotech’s Ultra Fusion 300 can now be further enhanced with automated 2D Metrology IPQC (In-process Quality Control), enabling continuous automatic inline measurement of both top and bottom conductor widths, ensuring accurate and repeatable measurements results with fast and simple sampling and advanced traceability.
About Orbotech Smart Factory
Orbotech Smart Factory is Orbotech’s solution for Industry 4.0 and is compatible with all Orbotech solutions. Orbotech Smart Factory’s full automation, traceability, data analysis and bi-directional real time connectivity between all Orbotech systems, enables a centralized database for production monitoring and management reports, full automation with easy to retrieve production data, and full data sharing.
About Sprint 200 Flex
The Sprint 200 Flex Inkjet Printer is Orbotech’s mass production digital legend inkjet printing solution optimized for flex multi-panel PCB production. This latest addition to Orbotech’s family of high performance PCB legend inkjet printers delivers cost-effective, top quality industrial inkjet printing for a consistently accurate production of even the most complex legend designs. The Sprint 200 Flex offers manufacturers breakthrough performance for high volume, high yield and high quality legend and serialization printing over a range of flex PCB materials.
About InCAM Flex, InPlanFlex, InStack and InSight PCB
These pre-production software solutions are smartly connecting and automatingPCB/FPC/IC product and process modeling across design to manufacturing flow, while securing IP and enabling an uncompromised quality. InCAMFlex and InPlan Flex are smart pre-production software solutions for rigid, flex and rigid-flex PCB production. InCAM Flex is a dedicated CAM solution that combines analysis and editing capabilities with automatic production data optimization to perform high-precision CAM tooling for flex and rigid-flex manufacturing. InPlan Flex is a comprehensive automatic engineering system that combines sophisticated engineering know-how with state-of-the-art pre-production planning tools to design the optimal manufacturing process.InStack is an automatic stackup designer dedicated to generating the best possible stackups for quality, manufacturability and price. InSight PCB is a web-based tool for smart and quick incoming customer PCB data assessment for sales people and engineers.
About Orbotech Ltd.
Orbotech Ltd. is a leading global supplier of yield-enhancing and process-enabling solutions for the manufacture of electronics products. Orbotech provides cutting-edge solutions for use in the manufacture of printed circuit boards (PCBs), flat panel displays (FPDs), and semiconductor devices, designed to enable the production of innovative, next generation electronic products and improve the cost effectiveness of existing and future electronics production processes. Orbotech’s core business lies in enabling electronic device manufacturers to inspect and understand PCBs and FPDs and to verify their quality, pattern the desired electronic circuitry on the relevant substrate and perform three dimensional shaping of metalized circuits on multiple surfaces, and utilize advanced vacuum deposition and etching processes in SD and semiconductor manufacturing. For further information, visit orbotech.com.
Share on:
Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.