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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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EPA Publishes Chemical Safety Framework Rules
July 3, 2017 | IPCEstimated reading time: Less than a minute
The Environmental Protection Agency (EPA) released three final rules as required under the Lautenberg Chemical Safety Act (LCSA) passed one year ago to reform and update the Toxic Substances Control Act (TSCA). The rules establish EPA’s procedures for evaluating and regulating chemicals in commerce. The new rules and other documents will affect not only chemical manufacturers but also airplane, auto, electronic parts, paint, and other manufacturers and their suppliers and customers.
The three final rules set the procedures by which the EPA — working with information and perspectives provided by interested and affected parties — will:
- Reset the TSCA inventory to only include chemicals active in the last 10 years
- Select chemicals as high or low priorities for risk evaluation; and
- Set out how the EPA will evaluate the risks of high-priority chemicals.
Additionally, the agency released strategies, or “scoping documents,” for the first 10 chemicals to be evaluated under LCSA, some of which are used by the electronics manufacturing industry. The EPA invited all interested parties to submit information about those chemicals to help it evaluate their risks.
IPC has been actively engaged during the passage of LCSA and will continue to advocating for our member’s concerns during implementation.
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Sweeney Ng - CEE PCBSuggested Items
IPC CFX Demo Line Debuts in Korea at EMK 2026
04/10/2026 | Global Electronics AssociationAt Electronics Manufacturing Korea (EMK) x NEPCON Korea 2026, the Global Electronics Association, in collaboration with 13 companies, showcased the IPC CFX Demo Line (Connected Factory Exchange demonstration line), marking its debut in Korea.
IPC-7712 Development Advances at APEX EXPO: Committee Aligns on Scope, Structure, and Industry Priorities
04/10/2026 | Circuit Technology Center, Inc.Significant progress was made in developing the proposed standard IPC-7712, Component Safe Removal for Failure Analysis and Reclamation, during in-person meetings held at APEX EXPO, March 16 to 18.
2026 IPC Masters Competition China Wraps Up With Record Participation
04/07/2026 | Blair Yan, Global Electronics Association East AsiaThe three-day 2026 IPC Masters Competition concluded March 27 at productronica China in Shanghai, bringing together the largest and most highly skilled group of electronics assembly professionals in the event’s 16-year history. With 623 participants from 77 companies across China—up 30% from last year—the competition reflected a growing focus on the practical application of electronics manufacturing standards.
IPC Masters Competition China 2026 Unveils Winners, Empowering Advanced Talent Development in Electronics Manufacturing
04/01/2026 | Global Electronics AssociationOn March 25–27, the IPC Masters Competition China was held in Pudong, Shanghai. This year’s competition brought together 623 leading professionals in the electronics industry from 21 provinces and municipalities.
Global Electronics Association, MIMOS Berhad Sign MoU to Advance Malaysia’s Electronics and Semiconductor Ecosystem
03/31/2026 | Global Electronics AssociationThe Global Electronics Association and MIMOS Berhad recently signed a Memorandum of Understanding (MoU) to collaborate in strengthening Malaysia’s electronics and semiconductor ecosystem, with a focus on advanced electronic packaging (AEP), industry alignment, and global best practices.