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Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
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EIPC SpeedNews: News from the European PCB Industry
August 7, 2017 | EIPCEstimated reading time: Less than a minute
- Call for Papers for EIPC Winter Conference Lyon, France, February 1–2, 2018
- SMT Hybrid Packaging 2018: Call for Tutorials Launched
- Schweizer Electronic AG: Preliminary Figures for the First Half Year 2017 and Adjustment of Forecast
- IoT Growth Slower than Expected
- Made in China 2025: Make or Break for Europe?
- Forthcoming SMART Dates for 2017
- IMAPS News for July 2017.... Holiday Time is Coming!
- The "RELPACK" Reliability Conference
- Ventec's Martin Cotton Joins Speaker Line-up at Advancements in Thermal Management Conference 2017
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11/27/2024 | IDCWorldwide smartphone shipments are forecast to grow 6.2% year-over-year in 2024 to 1.24 billion units, according to the latest International Data Corporation (IDC) Worldwide Quarterly Mobile Phone Tracker.
WSTS Semiconductor Market Forecast Spring 2024
11/26/2024 | WSTSWSTS has adjusted its Spring 2024 forecast upwards, projecting a 16.0 percent growth in the global semiconductor market compared to the previous year.
IPC Japan Puts More Focus on Collaboration, Standards Development, Advanced Packaging
11/26/2024 | Yusaku Kono, IPC Japan RepresentativeIn the past year, IPC has strengthened its relationships with key Japanese companies and government bodies. This was accomplished, in part, by a visit to Japan this past summer, where members of the IPC Asia team, punctuated by standards committee work last winter, forged stronger ties with government officials and companies involved in electronics manufacturing.
Global Notebook Shipments Expected to Grow by 4.9% in 2025, Business Demand Emerges as a Key Driver
11/25/2024 | TrendForceTrendForce reports that the global notebook market in 2024 is projected to recover at a moderate pace, hindered by high interest rates and geopolitical uncertainties.
Real Time with... electronica 2024: SPEA's AI Integration—Innovations in Test Equipment
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