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Current IssueIn Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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EIPC SpeedNews: News from the European PCB Industry
August 7, 2017 | EIPCEstimated reading time: Less than a minute

- Call for Papers for EIPC Winter Conference Lyon, France, February 1–2, 2018
- SMT Hybrid Packaging 2018: Call for Tutorials Launched
- Schweizer Electronic AG: Preliminary Figures for the First Half Year 2017 and Adjustment of Forecast
- IoT Growth Slower than Expected
- Made in China 2025: Make or Break for Europe?
- Forthcoming SMART Dates for 2017
- IMAPS News for July 2017.... Holiday Time is Coming!
- The "RELPACK" Reliability Conference
- Ventec's Martin Cotton Joins Speaker Line-up at Advancements in Thermal Management Conference 2017
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Siemens Announces PAVE360 Support for New Arm Zena Compute Subsystems
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