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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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EIPC SpeedNews: News from the European PCB Industry
August 25, 2017 | EIPCEstimated reading time: 1 minute
- Extended Deadline: Call for Papers for EIPC Winter Conference Lyon
- Aspocomp's Half Year Financial Report 2017
- The Hermes Standard: Viscom Working on First Field Tests
- UNIMICRON Given Go-ahead for Reconstruction
- Eltek Reports 2017 Second Quarter Financial Results
- Reliability and Process Trouble Shooting with SMART Group Events
- ICT Evening Seminar, Newtown House Hotel, Hayling Island, September 19
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Sweeney Ng - CEE PCBSuggested Items
STMicroelectronics Enables Always-On Vision with Ultralow-Power Image Sensors
05/01/2026 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, introduces a new generation of ultralow-power global-shutter image sensors that deliver high-quality, always-on vision to compact devices operating on batteries or harvested energy.
Alpha, Omega Semiconductor Launches SmartClamp DrMOS for AI Servers and GPUs
05/01/2026 | AlphaAlpha and Omega Semiconductor Limited (AOS) a designer, developer, and global supplier of a broad range of discrete power devices, wide bandgap power devices, power management ICs, and modules, announced the launch of the SmartClamp™ family of protected DrMOS.
Neusoft Smart Go, Tencent Cloud Partner on AI-Powered Intelligent Cockpit Ecosystem
05/01/2026 | PRNewswireThe company now aims to become a global leading provider in full-domain upper-body electronics solutions for intelligent vehicles.
Zhen Ding, Tsinghua University Launch Phase II R&D and Digital Transformation Program
04/30/2026 | Zhen DingZhen Ding Technology Holding Limited, a global leader in the PCB industry, held the launch ceremony for the Phase II (2026-2030) Industry-Academia Collaboration Program of the Zhen Ding-Tsinghua Joint Research Center at the Zhen Ding Technology Lecture Hall on the Tsinghua University campus.
SEMIEXPO Heartland 2026 Highlights Automotive Electronics and Smart Manufacturing Innovation
04/29/2026 | SEMIThe second edition of SEMIEXPO Heartland opens this week, April 29-30 at the Detroit Marriot at the Renaissance Center in Detroit, Michigan, centered around smart manufacturing, automotive electronics, and workforce development.