It’s Only Common Sense: Invest in Yourself—You’re Your Most Important Resource
Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
Ventec to Showcase Thermal Management and Latest Laminate Solutions at productronica
October 30, 2017 | Ventec International GroupEstimated reading time: 3 minutes
Ventec International Group, a world leader in the production of insulated metal substrates, thermally conductive polyimide and high-reliability laminates and prepregs, will showcase its comprehensive range of laminate materials at this year’s productronica. With an emphasis on the latest in thermal management technology, the Ventec team will be on hand in Hall B3 at booth #244 to showcase unique laminate & prepreg capability across a very wide range of applications and budgets.
Automotive manufacturers around the world, including Ford, Tesla, VAG, Audi, Skoda, Seat, Volkswagen, Tata, Bentley, Daimler Benz, BMW, Renault-Nissan, Jaguar/Land Rover, Maclaren Automotive, already rely on Ventec's thermal management materials for a range of applications including LED headlights, ECU, brake energy reclamation & e-power train establishing Ventec as a global leader in technology for high performance thermal management materials.
One such material making its European debut at productronica is Ventec's VT 5A2 material. It sets itself apart by offering highest performance thermal conductivity 8 times that of FR-4 at 2.2 W/m.K, a high Tg of 190°C, best in class thermal performance (T260 >60 Minutes, T288 >30 Minutes and T300 >15 Minutes) and MOT of 150°C. VT-5A2 is lead-free assembly compatible, fulfills RoHS and WEEE requirements and complies with UL94 V0. This material has been developed for a range of thermally demanding automotive applications.
Other show highlights include:
Product & Material Showcase
A special product & material showcase will demonstrate PCB material applications in a variety of end-products including a Mercedes Benz C-Class Headlamp (kindly provided by grupo eurocir) featuring an Alu substrate PCB (BiGL) made with Ventec’s VT-4B5 material.
tec-speed high-speed/low-loss materials
The tec speed brand unites one of the most comprehensive range of products in high speed/low loss PCB material technology. Every tec-speed product provides technological innovation, high performance and quality to customers to perfectly meet their needs.
Tamara den Daas (Global Account Manager - OEM Technology) will be presenting her paper on Ultra-Low Dk Material for high-speed & low-loss applications in the PCB & EMS Marketplace Forum (Hall B3/360) on Friday 17th November at 10:00. Tamara will address some of the key issues faced by most high-speed designs today. She will outline concept and technology requirements and define the key issue’s and problem’s in high speed PCB’s and backplanes related to trace width and construction and the current or today’s limitations on the designer and manufacturer to create low loss differential pair traces.
Presenting space and aerospace PCB material capability
Ventec manufactures its polyimide and thin-core laminates using specially designed treaters with multiple stage filtration systems and 100% Automated Optical Inspection (AOI) for prepreg FOD-control. Most recently Ventec's VT-901 polyimide material received full qualification by ESA in Amphenol Invotec’s manufacturing process for rigid and Flex-rigid PCBs, putting both companies in a market-leading position within the space and aerospace electronics supply chain.
Base-materials, laminates, drilling boards and other consumables
Backed by its fully owned and controlled global supply chain that ensures product quality, consistency and reliability, Ventec offers customers a one-stop-shop for their laminates and PCB base material needs. Ventec’s wider product offering that includes complementary products such as flex- & rigid-flex circuit board materials, back-up, entry & routing materials, foils, clean room products and coatings, will be presented at the show.
Ventec App relaunch following extensive facelift
The Ventec APP has had a complete facelift giving direct access to all technical updates and news at the touch of a button. With an improved and intuitive user-interface, the app provides up-to-the-minute information on all developments, technical data updates, ongoing projects and news from Ventec's operations across the world including the latest data sheets and process guidelines. The Ventec app is completely free to download and is compatible with all Apple and Android devices. Visitors to the Ventec booth will have the chance to win an Apple iPad or Samsung Tablet by entering into the Ventec-APP-Prize draw.
About Ventec International
With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, click here.
Share on:
Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.