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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Registration Now Open for IPC APEX EXPO 2018
October 30, 2017 | IPCEstimated reading time: Less than a minute
IPC—The Association Connecting Electronics Industries has announced that registration is now open for the IPC APEX EXPO 2018 conference and exhibition, which will be held from February 27 to March 1, 2018, at the San Diego Convention Center in San Diego, California, USA. The Meetings and Courses will be held from February 24 to March 1, 2018.
With the theme Succeed at the Velocity of Technology, IPC APEX EXPO 2018 will provide an outstanding amount of the education and insights needed to keep up with an industry that keeps moving forward.
For more information or to register, click here.
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Rachael Temple - AlltematedSuggested Items
Advanced Materials Roundtable
04/23/2026 | I-Connect007 Editorial TeamDriven largely by the need for advanced chip technology for super compute ability and AI applications, low Dk, low-loss resin systems, and heavy copper laminate are attracting significant attention and global resources. There are numerous unavoidable challenges in this market that will impact manufacturers and the supply chain, and they may be hitting critical mass sooner than OEMs and fabricators think. In this roundtable discussion, moderator Marcy LaRont speaks with topic experts: Mark Goodwin, John Fix, and Ed Kelly.
Silicon Box Joins imec Automotive Chiplet Program to Strengthen Next-Gen Vehicle Supply Chains
04/22/2026 | PRNewswireSilicon Box, an industry leader in advanced semiconductor packaging solutions, announced that it has formally joined imec's Automotive Chiplet Program (ACP), a collaborative research initiative aimed at accelerating chiplet technology adoption required to drive the development of next-generation vehicles.
Mitate Zepto Technica Joins JST Edge AI Semiconductor R&D Program as Implementation Partner
04/22/2026 | PRNewswireMitate Zepto Technica, Inc., based in Tokyo's Shibuya district, announced on April 20 that it has joined the national research initiative "Next-Generation Edge AI Semiconductor Research and Development Program" promoted by the Japan Science and Technology Agency (JST).
Wearable Technology Market Expected to Reach $183.2 Billion by 2031, Growing at a CAGR of 12.75%
04/22/2026 | PRNewswireAccording to the report, the global wearable technology market size was valued at USD 54.8 billion in 2020 and is projected to reach USD 183.2 billion by 2031, registering a CAGR of 12.75% from 2022 to 2031.
Camtek Acquires Visual Layer to Strengthen Visual AI Capabilities in Inspection and Metrology
04/21/2026 | CamtekCamtek Ltd., a leading developer and manufacturer of inspection and metrology equipment for the semiconductor industry, announced that it has signed a definitive agreement to acquire Visual Layer, a Tel Aviv-based AI company specializing in visual analytics.