-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueIn Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Registration Now Open for IPC APEX EXPO 2018
October 30, 2017 | IPCEstimated reading time: Less than a minute
IPC—The Association Connecting Electronics Industries has announced that registration is now open for the IPC APEX EXPO 2018 conference and exhibition, which will be held from February 27 to March 1, 2018, at the San Diego Convention Center in San Diego, California, USA. The Meetings and Courses will be held from February 24 to March 1, 2018.
With the theme Succeed at the Velocity of Technology, IPC APEX EXPO 2018 will provide an outstanding amount of the education and insights needed to keep up with an industry that keeps moving forward.
For more information or to register, click here.
Suggested Items
STARTEAM GLOBAL Unveils Innovative Additive Solder Mask Process
06/02/2025 | STARTEAM GLOBALSTARTEAM GLOBAL, a leading PCB manufacturer, has introduced a revolutionary additive solder mask process at its Flero STARTEAM (FST) factory in Italy, leveraging digital inkjet technology to enhance production efficiency and sustainability.
Strategic Materials Conference 2025 Spotlights Materials Innovation to Advance Semiconductor Manufacturing
06/02/2025 | SEMIWith materials innovation at the core of next-generation semiconductor technologies, the Strategic Materials Conference (SMC) 2025 brings together top executives and technology leaders from the semiconductor manufacturing industry for exclusive insights into the latest trends and advancements.
CACI to Deliver Additional SIGINT and EW Technology for U.S. Army Soldiers with TLS BCT Manpack
06/02/2025 | CACI International Inc.CACI International Inc announced that a contract modification has been awarded by the U.S. Army to continue procurement, training, and fielding for the Terrestrial Layer System Brigade Combat Team Manpack (TLS BCT Manpack).
Hon Hai Research Institute Partners with Taiwan Academic Research Institute and KAUST to Participate in CLEO 2025
05/30/2025 | FoxconnThe research team of the Semiconductor Division of Hon Hai Research Institute, together with the research teams of National Taiwan University and King Abdullah University of Science and Technology in Saudi Arabia, has successfully made breakthroughs in multi-wavelength μ -LED technology to achieve high-speed visible light communication and optical interconnection between chips.
Meyer Burger Shuts Down Solar Module Production, Lays Off 282 Employees in the U.S.
05/30/2025 | Meyer BurgerMeyer Burger Technology AG is forced to stop its solar module production in the U.S., which is still ramping up, due to a lack of funds. On May 29, 2025, all 282 remaining employees at the Goodyear, Arizona, site received their notices of termination. Production with an annual capacity of 1.4 gigawatts was shut down immediately.