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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Market Insights with Pluritec's Maurizio Bonati
April 23, 2026 | Real Time with... APEX EXPOEstimated reading time: 1 minute
Nolan Johnson interviews Maurizio Bonati, VP of Sales at Pluritec, at APEX EXPO 2026. Bonati details Pluritec's three product divisions, covering a broad spectrum of PCB manufacturing. He discusses the current robust electronics market, driven by AI applications in Asia and technological investments in North America, while noting slower demand in Europe. The interview highlights key sectors like data centers, AI, and medical that benefit from advanced electronics.
APEX EXPO 2026 has concluded successfully. If you couldn’t make it to the show, don’t worry, the I-Connect007 team has coverage of the entire week’s events. Watch your inbox on Fridays over the next several weeks for our complete coverage, delivered directly to your inbox, or visit Real Time with… APEX EXPO 2026 now for video interviews with the movers and shakers of the electronics industry.
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Rachael Temple - AlltematedSuggested Items
Road to Reliability: Engineering High Uptime EV Charging Infrastructure
05/13/2026 | Stanton Rak, SF Rak CompanyThe transition to EVs is no longer constrained solely by vehicle capability. Instead, it is increasingly defined by a simpler, but more unforgiving question: Will the charger work when I arrive? This high uptime does not happen by accident. As EV technology has matured, limitations in battery range, power electronics, and thermal management are no longer the primary barriers to adoption.
More Than a Field Trip: Young Students Step into the World of Electronics and Semiconductors
05/13/2026 | Michigan Tech Electronics HubThe energy is electric at Michigan Technological University as 164 fourth graders from Michigan’s western Upper Peninsula trade their traditional desks for a day of high-tech exploration. The students are here to pilot Stories & Semiconductors, a new educational series. By following the adventures of characters who solve problems through electronics, young students don’t just read about technology; they build it themselves.
Federal Electronics’ Hermosillo Facility Now CSA-Certified for Wire Harness Assemblies
05/13/2026 | Federal ElectronicsFederal Electronics, a leader in providing advanced electronic manufacturing services, announced that its Hermosillo, Mexico facility has been approved to apply the CSA mark to wire harness assemblies.
I-Connect007 Announces Upcoming Issue of Advanced Electronics Packaging Digest
05/13/2026 | I-Connect007The next issue of Advanced Electronics Packaging Digest examines the materials, architectures, and integration strategies shaping the next phase of electronics innovation, from reinforcement materials under thermal and frequency pressure to heterogeneous integration and advanced packaging as a system-level scaling factor.
Indium Experts to Address Data Center Thermal Management and Sintering Standards at SMTA Conference
05/13/2026 | Indium CorporationAs a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge on two critical industry topics—data center thermal management and sintering protocols—at the SMTA Electronics in Harsh Environments Conference, May 19-21, in Amsterdam, Netherlands.