-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
IPC Awards IPC-4101 Qualified Products Listing to Ventec International Group
November 13, 2017 | Ventec International GroupEstimated reading time: 2 minutes
Ventec International Group is delighted to announce an IPC-4101 Qualified Products Listing (QPL). The IPC's validation services program has qualified VT-90H and VT-901 to specification sheet 41 of IPC-4101E, specification for base materials for rigid and multilayer printed boards. An intensive two-day audit was also completed where the manufacturing practices, test methods and conformance requirements of IPC-4101 were reviewed.
VT-90H (UL-94 HB) and VT-901 (UL-94 V0) are exceptional material solutions for high reliability ML rigid and flex rigid PCBs for use in thermally challenging environments, with high Td (VT-901=395, VT-90H=408), a Tg of 250oC and Low-Axis CTE (50). Both polyimide materials provide the extremely high reliability performance particularly demanded by military and aerospace as well as downhole drilling and similarly challenging applications.
Ventec manufactures, fabricates and distributes all VT-90H and VT-901 polyimide from AS9100 accredited facilities, using specially designed treaters with multiple stage filtration systems and 100% Automated Optical Inspection (AOI) for prepreg FOD-control. The same specialist equipment is used for the production of thin-core laminates for use in the most demanding space and aerospace PCB applications.
Mark Goodwin, COO USA & EMEA of Ventec International Group commented: "Applying for an IPC Qualified Product Listing (QPL) for our polyimide laminate and prepreg provides an independent endorsement of the quality of our production controls and materials for use in high reliability mil/aero applications. The IPC QPL is a trusted reference list for the entire electronics supply chain. As a world leader in the production of high performance laminates and prepregs, we are delighted to be the first copper clad laminate manufacturer to have a polyimide material added to the IPC QPL following a rigorous facility audit, as well as meeting the requirements of the qualification testing program at an independent test laboratory."
IPC's Validations Services QPL/QML Program was developed to promote supply chain verification. It also provides auditing and certification of electronics companies' products, and identifies processes which conform to IPC standards.
"Ventec has differentiated itself from the competition by becoming part of IPC's global network of trusted industry sources," said Randy Cherry, IPC director of Validation Services. "We are pleased to recognize Ventec as the first member of trusted QPL suppliers to meet IPC 4101 from the country of China."
About IPC
IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,600 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
About Ventec International
With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, click here.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Beyond the Board: What Companies Need to Know Before Entering the MilAero PCB Market
09/16/2025 | Jesse Vaughan -- Column: Beyond the BoardThe MilAero electronics supply chain offers opportunities for manufacturers that are both prestigious and strategically important. Serving prime contractors and Tier-1 suppliers can mean long-term program stability and the satisfaction of contributing to national security. At the same time, this sector is unlike commercial electronics in almost every respect. Success requires more than technical capabilities, it requires patience, preparation, attention to detail, and a clear understanding of how the business model differs.
India’s Aerospace and Defence Engineered for Power, Driven by Electronics
09/16/2025 | Gaurab Majumdar, Global Electronics AssociationWith a defence budget of $82.05 billion (2025–26) and a massive $223 billion earmarked for aerospace and defence spending over the next decade, India is rapidly positioning itself as a major player in the global defence and aerospace market.
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
Global Interposer Market to Surge Nearly Fivefold by 2034
09/15/2025 | I-Connect007 Editorial TeamRevenue for the global interposer market is projected to climb from $471 million in 2025 to more than $2.3 billion by 2034, according to a new report from Business Research Insights. The growth represents a CAGR of nearly 20 percent over the forecast period.
ICAPE Group Unveils Exclusive Report on Sustainability in Electronics Manufacturing
09/15/2025 | ICAPE GroupICAPE Group, a global leader in printed circuit boards (PCBs) and custom electronics manufacturing, today announces the launch of its 2025 Industry Outlook & Innovation Report: Sustainability in Electronics Manufacturing. This exclusive report is accompanied by fresh insights from a dedicated Statista survey of 100 electronics manufacturing professionals, commissioned by ICAPE Group.