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From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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Video from productronica 2017: DIS Improves Registration of Flex and Rigid-Flex PCBs
November 20, 2017 | I-Connect007Estimated reading time: Less than a minute

From the show floor at productronica 2017, we stopped by the DIS booth for a conversation with Tony Faraci. Here, he explains how DIS has tackled the challenges of handling and alignment of flex-rigid multilayer builds (especially cut-out pre-preg layers and packing pieces) and automated what was previously an operator-dependent manual process.
Watch The Interview Here:
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