-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
SMTA Seeking Abstracts for SE Asia Technical Conference
November 24, 2017 | SMTAEstimated reading time: Less than a minute
The Surface Mount Technology Association (SMTA) is inviting the industry to submit abstracts for the 2018 SE Asia Technical Conference on Electronics Assembly, which will be held on May 8–10, 2018, in Kuala Lumpur, Malaysia.
Co-located with Semicon Southeast Asia, the South East Asia Technical Conference on Electronics Assembly is a highly technical three-day event that is focused on today's most important and timely issues.
Presentations and course abstracts are being sought in the following key technology tracks:
- Assembly
- Contract Manufacturing
- 3D Package Integration
- Advanced Integrated Systems and Devices
- Wafer-Level Packaging
Abstracts are due January 15, 2018, and papers and presentations will be due April 7, 2018.
For more information, click here.
Suggested Items
SMTA Long Island Chapter Celebrates 30th Anniversary with Membership Appreciation Event
04/25/2024 | SMTAThe Surface Mount Technology Association (SMTA) Long Island Chapter is thrilled to announce its 30th Anniversary and Membership Appreciation Event on Wednesday, May 15th, 2024, from 5:30 to 8:30 p.m. EST. The event will take place at Top Golf Long Island-Holtsville, promising an evening of camaraderie, celebration and fun-filled activities.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
SMTA Announces Program for High Reliability: Strategic Technology Advancement Research Forum
04/08/2024 | SMTAThe SMTA announced the finalized program for the High Reliability: Strategic Technology Advancement Research Forum which takes place on May 2, 2024 in Olathe, Kansas, USA. The event, now in its second year, addresses challenges for electronics manufacturers in the high reliability sector.
SMTA Conducts First UHDI Symposium
03/29/2024 | Marcy LaRont, PCB007 MagazineSMTA’s first UHDI Symposium in Peoria, Arizona, on Tuesday, March 26 featured a standout full-day technical program with 11 separate presentations on what will be required for our companies to move to ultra HDI manufacturing. The event was the brainchild of Tara Dunn, SMTA director of training and education. It included a compelling and collaborative presentation by David Haboud of Altium, John Johnson of American Standards Circuits, and Chrys Shea of Shea Engineering, who had spent the past several weeks creating and building an appropriate SMT test board vehicle for UHDI, something that was passed around for all conference goers to see and touch.
UHDI Fundamentals: ASC Sponsors Ultra High Density Interconnect Symposium
03/21/2024 | Anaya Vardya, American Standard CircuitsAmerican Standard Circuits (ASC) is a major sponsor of an upcoming symposium on one of the most talked about new technologies that has come along in quite a while: ultra high density interconnect (UHDI).