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Keysight Enables UC Berkeley Research to Advance 6G Over-the-Air Testing

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IMI's ATC Lab Brings World-Class Calibration and Testing Expertise to the Healthcare Sector

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09/22/2026 | I-Connect007
As PCB technology has evolved, the structures being evaluated become more complex. But have the methods used to determine their reliability evolved at the same pace? In The Printed Circuit Assembler's Guide to... Via Structures: Reflow Process Survivability, Reliability, and Robustness, Bob Neves challenges some long-held assumptions about how the electronics industry evaluates PCB via structures. He draws on decades of reliability experience, and examines not only how we test, but what those tests actually tell us.

Würth Elektronik Receives First TDAP Stage 2 Certificate for EMC Chokes

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The Test Connection Inc. to Showcase Electronic Test Solutions at SMTA Guadalajara 2026

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TTCI will exhibit as part of the USM Reps booth 910, connecting with electronics manufacturing professionals from across Mexico and the international electronics industry.
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