The Knowledge Base: The Value of Industry Certifications
Global Citizenship: Bringing Two Cultures Together in PCB Manufacturing
Standard of Excellence: It Starts With Company CultureReal Time with… IPC APEX EXPO 2024: Exploring Electronic Card Testing and AI Integration with SPEA
May 2, 2024 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute
Luca Fanelli, President of SPEA, and Andrea Furnari, Vice President, give insight into the company and its business units. The challenges in testing electronic cards and the company's solutions are discussed. SPEA has a global reach and focus on the US market are emphasized. The use of AI in testing, particularly in optical inspection and test program execution, is examined.
Click to watch the interview on our Real Time with... IPC APEX EXPO 2024 event site.
Share on:
Suggested Items
iNEMI Packaging Tech Topic Series: Damage-Free Rapid Electron Beam Testing for Advanced Packaging
07/24/2024 | iNEMITesting issues are limiting chip makers’ ability to create larger SOCs (system-on-chip). The scan field dimensions of EUV (extreme ultraviolet light) and NA (numerical aperture) EUV, which are typically used for testing, are too small.
Keysight, University of Malaga’s MobileNet Join Forces to Accelerate Open RAN Development with RAN Intelligent Controller Testing
07/23/2024 | BUSINESS WIREKeysight Technologies, Inc. announces that the University of Malaga, specifically the MobileNet: Mobile & Aerospace Networks Lab within the Telecommunications Institute (TELMA), has selected its RAN Intelligent Controller Test Solutions (RICtest).
New Breakthrough in Double-Sided Reflow Part Retention from Alltemated
07/19/2024 | AlltematedAlltemated's PLACE-N-BOND™ underfilm passed testing and was implemented in volume production to aid in component retention during the second pass reflow of printed circuit assemblies. This successful testing and implementation occurred in various applications with components such as capacitors, inductors, transformers, connectors, and larger ICs.
iNEMI Packaging Tech Topic Series: Damage-Free Rapid Electron Beam Testing for Advanced Packaging
07/16/2024 | iNEMITesting issues are limiting chip makers’ ability to create larger SOCs (system-on-chip). The scan field dimensions of EUV (extreme ultraviolet light) and NA (numerical aperture) EUV, which are typically used for testing, are too small. To enable larger chips, manufacturers are migrating to system-on-a-package (SOP).
GEN3 Announces First Shipment of Next-GENeration CM Contaminometer to Renowned Aerospace Company in Germany
07/09/2024 | Gen3GEN3, Global leader in SIR, CAF, Solderability, Ionic Contamination & process optimisation equipment, is pleased to announce the first shipment of its newly released next-GENeration CM Contaminometer Process Ionic Contamination Tester to a world renowned aerospace company at their facility in Germany.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in