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Real Time with… IPC APEX EXPO 2024: Exploring Electronic Card Testing and AI Integration with SPEA
May 2, 2024 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute
Luca Fanelli, President of SPEA, and Andrea Furnari, Vice President, give insight into the company and its business units. The challenges in testing electronic cards and the company's solutions are discussed. SPEA has a global reach and focus on the US market are emphasized. The use of AI in testing, particularly in optical inspection and test program execution, is examined.
Click to watch the interview on our Real Time with... IPC APEX EXPO 2024 event site.
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Sweeney Ng - CEE PCBSuggested Items
Gardien Services Installs Customized G93 Flying Probe Tester – Largest Test Area in North America/Europe
08/24/2025 | Gardien GroupGardien Group is proud to announce the successful installation of a customized G93 Flying Probe Test Machine at a major manufacturer in North America. This cutting-edge system features the largest test area of any flying probe tester in North America and Europe, setting a new benchmark for PCB testing capabilities.
Meet with The Test Connection Inc. (TTCI) at SMTA Guadalajara 2025
08/18/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions for more than 45 years, is pleased to announce its participation at the upcoming SMTA Guadalajara Expo & Tech Forum, taking place September 17–18, 2025, at Expo Guadalajara, Salón Jalisco Hall D & E.
MoU to Revolutionize Photonic Integrated Circuit (PIC) Device Testing with AI-Driven Solutions
08/07/2025 | PRNewswireLightium AG, MPI Corporation, and Axiomatic_AI Inc. have entered into a Memorandum of Understanding (MoU) to jointly develop the world's first Intelligent, Autonomous, and Integrated Test Solution (IAITS) for photonic devices.
Register Now for the HATS²™ Technical Day at GEN3 HQ
08/05/2025 | GEN3GEN3 a world-leading manufacturer of testing, measurement and production solutions for electronics reliability. Headquartered in Farnborough, UK, GEN3 is announcing the final call for registrations to attend the exclusive HATS²™ Technical Day — a hands-on, live demonstration event showcasing the Highly Accelerated Thermal Shock Tester (HATS²™), the groundbreaking innovation from industry pioneer Bob Neves.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.