It’s Only Common Sense: Invest in Yourself—You’re Your Most Important Resource
Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
TUC Announces Plant Expansion and Financial Report
December 26, 2017 | TUCEstimated reading time: 1 minute
Taiwan Union Technology Corporation (TUC), manufacturer of copper-clad laminates (CCL) and prepregs for electronic interconnects, reported first half earnings per share of NT2.36. TUC continues to expand capacity for high-speed substrates, spending NT140 million to buy an adjacent property. TUC is expected to invest NT1.46 billion to build and equip the state of the art plant. The new plant is expected to begin operations in 2019.
TUC production includes CCL, prepregs and high-speed substrates. CCL and prepregs counted for about 80% of the shipments and high-speed substrates for about 20%. The main production base includes one plant and company headquarters in Taiwan and two plants in mainland China located in Changshu and Zhongshan. TUC’s focus has been on high Tg base materials as well as high-speed, low loss products. For IC carrier material, the dielectric constant (Dk) will affect the signal transmission speed, and the dissipation factor (Df) will affect the quality of the signal transmission. When these two factors are optimized in the base material, lower signal delay (Signal Propagation Delay Time) and reduced signal transmission loss (Signal Transmission Loss) can be achieved. With these factors in mind, TUC developed base materials with fast transmission speed and improved signal integrity with its Thunderclad line of products. The market demand for these products has been mainly in servers, base control panels and storage devices. TUC enjoys a leading technological position in the high Tg and low Dk products for the domestic industry. TUC is the first to mass produce for the 100G switch substrates.
Benefiting from the high growth of high-speed transmission products, TUC performed well in the past two years. In the first half of 2017, consolidated revenue was NT7.81 billion, the operating gross profit was NT1.67 billion, and the consolidated gross profit margin was 21.4%. Finally, the pre-tax profit of NT760 million was realized with an after-tax profit of NT570 million, generating earnings per share of NT2.36.
Share on:
Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.