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Free UV Curing Guide Offers Top Tips from Intertronics
January 9, 2018 | IntertronicsEstimated reading time: 1 minute
The curing of materials like adhesives, coating, encapsulants, potting compounds, temporary masking materials or gaskets with UV light offers many process advantages, and can deliver productivity enhancements to manufacturers. The ability of the technology to deliver full cure in seconds (rather than minutes or hours) is a prime example.
The materials are predominantly single part (no mixing) and only cure on demand, so application or dispensing is straightforward and readily automatable. The light curing process looks quite simple, and indeed it is. But like most things, there is a learning curve.
The latest publication from Intertronics, "Top Tips for Getting the Best from your UV Curing Process," breaks down the elements of this technology. The aim is to give a better understanding of the way that UV curing works and to discuss the process variables. A good grasp of the fundamentals will help engineers, technicians and operators to set up an established process which is effective, robust and repeatable. Along the way, there are some rules of thumb and tricks of the trade to make things easier and to ensure success.
The free guide discusses some of the differences between conventional UV curing lamps and the latest lamps based on LED technology.
For more information, click here.
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Brent Fischthal - Koh YoungSuggested Items
OKI Develops 180-Layer, 15 mm PCB for AI Semiconductor Test Equipment
04/29/2026 | BUSINESS WIREOKI Circuit Technology, the OKI Group’s printed circuit board (PCB) business company, has successfully developed design and production technologies for 180-layer, 15 mm-thick PCBs intended for use in wafer testing equipment for high bandwidth memory (HBM) mounted on AI semiconductors.
ASC’s John Johnson Bullish on the U.S. and High-tech PCBs
04/28/2026 | Marcy LaRont, I-Connect007It was a good couple of days at the SMTA UHDI Symposium in Avondale, Arizona, in early April, where John Johnson, head of technology at American Standard Circuits (ASC) and resident PCB expert on UHDI in the real-world of manufacturing, was a presenter. As the symposium ended, I visited with John, who reflected on what he considered most important and what had made the greatest impression on him.
Indium Awarded $3.2 Million DOE Grant to Establish Domestic Gallium Supply Chain
04/28/2026 | Indium CorporationIndium Corporation announced it has been awarded a $3.2 million grant by the U.S. Department of Energy’s (DOE) Office of Critical Minerals and Energy Innovation (CMEI) to develop a domestic process for recovering high-purity gallium from manufacturing by-products—a critical step toward establishing a secure, domestic supply chain for a material essential to modern defense systems, semiconductors, and advanced electronics.
Roundtable: Advanced Materials
04/27/2026 | I-Connect007 Editorial TeamDriven largely by the need for advanced chip technology for super compute ability and AI applications, low Dk, low-loss resin systems, and heavy copper laminate are attracting significant attention and global resources. There are numerous unavoidable challenges in this market that will impact manufacturers and the supply chain, and they may be hitting critical mass sooner than OEMs and fabricators think. In this roundtable discussion, moderator Marcy LaRont speaks with topic experts: Mark Goodwin, John Fix, and Ed Kelley.
Silicon Box Joins imec Automotive Chiplet Program to Strengthen Next-Gen Vehicle Supply Chains
04/22/2026 | PRNewswireSilicon Box, an industry leader in advanced semiconductor packaging solutions, announced that it has formally joined imec's Automotive Chiplet Program (ACP), a collaborative research initiative aimed at accelerating chiplet technology adoption required to drive the development of next-generation vehicles.