Rogers to Show Advanced Materials and Latest Research at DesignCon 2018

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Rogers Corporation will show some of its highest-performance circuit materials and share some of the highlights of extensive research on those materials, at the upcoming DesignCon 2018 Show. DesignCon is a premiere event for electronic design engineers working on circuit and system levels.

The DesignCon exhibition is January 31-February 1, 2018 in the Santa Clara Convention Center (Santa Clara, CA).  The technical conference and exhibition is now celebrating its 23rd year. Representatives from Rogers Corp. (www.rogerscorp.com) will be available at Booth #421.

Technical Presentation by Rogers’ Al Horn

As part of a diversified technical program at DesignCon 2018, Rogers’ Research Fellow Al F. Horn III will unveil the results of research on how different circuit materials affect the performance of high-frequency analog or high-speed digital transmission lines, in his talk “Effect of Conductor Profile on the Impedance and Capacitance of Transmission Lines,” Wednesday, January 31 in Ballroom C, from 11:00 to 11:45am.

On the DesignCon exhibition side, Rogers’ representatives will be available to help visitors achieve optimal performance levels with their circuit materials, with an emphasis on XtremeSpeed RO1200 laminates and RO4835 laminates.   

XtremeSpeed RO1200 Laminates

Network equipment designers need high performance circuit materials with superior electrical properties for applications like IP infrastructure, High Performance Computing and Test and Measurement. XtremeSpeed RO1200 circuit materials are engineered to meet the unique electrical and thermal/mechanical demands of high speed designs. Rogers XtremeSpeed RO1200 circuit materials enable system designers the flexibility to design leading edge systems that maximize data throughput and minimize latency in performance demanding applications.

With a low dielectric constant of 3.05, and a maximum dissipation factor of 0.0017 @10 GHz, these laminates provide outstanding signal integrity, reduced signal skew, and reduced cross-talk. Combined with superior thermal/mechanical performance, low CTE, and a halogen free UL 94 V-0 rating, these laminates are well suited for the most demanding high layer count applications.

RO4835 Laminates

RO4835 laminates extend Rogers’ portfolio of high performance materials by providing customers with a match to the industry’s most used high frequency material, RO4350B™ laminates. The material processes similar to FR-4, is automated assembly compatible due to a low z-axis CTE and high Tg, and RO4835 laminates behave very similar to RO4350B materials through lead-free soldering temperatures. Compositionally, RO4835 laminates share the same behavior and benefits of RO4350B materials, with the added benefit of improved long term thermal stability due to the reduced rate of oxidation. 

Of course, these are but a few examples of the circuit materials that visitors at DesignCon 2018 can see and learn more about at Rogers’ Booth #421. Rogers offers a wide range of circuit materials and laminates with characteristics that can be matched to the needs of specific designs and requirements, and visitors are invited to find the best matches for their applications. 

About Rogers Corporation

Rogers Corporation is a global technology leader in engineered materials to power, protect, and connect our world.  With more than 180 years of materials science experience, Rogers delivers high-performance solutions that enable clean energy, Internet connectivity, advanced transportation and other technologies where reliability is critical. Rogers delivers Power Electronics Solutions for energy-efficient motor drives, vehicle electrification, and alternative energy; Elastomeric Material Solutions for sealing, vibration management, and impact protection in mobile devices, transportation interiors, and performance apparel; and Advanced Connectivity Solutions materials for wireless infrastructure, automotive safety and radar systems. Headquartered in Chandler, Arizona (USA), Rogers operates manufacturing facilities in the United States, China, Germany, Belgium, Hungary, and South Korea, with joint ventures and sales offices worldwide. For more information, click here.