-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
APAC PCB Inspection Equipment Market to See CAGR of 14.72% during 2017-2021
February 6, 2018 | Business WireEstimated reading time: Less than a minute
The printed circuit board (PCB) inspection equipment market in APAC is expected to grow at a CAGR of 14.72% during the period 2017-2021.
One trend in the market is emergence of Industry 4.0. The major focus of Industry 4.0 or the Fourth Industrial Revolution is to develop smart factories and IoT for industries. The adoption of Industry 4.0 has allowed for industrial advances in technology with the help of advanced computing, analytics, low-cost sensing, and the new levels of connectivity enabled through Internet.
One driver in the market is increasing use of X-ray systems for inspection due to advent of BGAs, chip-scale packages, and flip-chips. The use of BGAs and chip-scale packages mostly in consumer electronics has helped in increasing functionality and reducing the size of products. The growth of the telecom industry in recent years has reinvigorated the need for using X-ray inspection systems while manufacturing PCBs. Owing to the very small size of BGAs, chip-scale packages, and flip-chips, they are invisible to the naked eye. Hence, X-ray inspection systems are employed as they can detect joint quality underneath these packages without the need to destroy the PCB equipment for testing and inspection.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/03/2024 | Nolan Johnson, I-Connect007This week’s most important news is strategic—and telling. When one puts together the IPC industry reports, we simply have to include the recent conversation with Shawn DuBravac and Tom Kastner. On the design side, check out the latest “On The Line With…” podcast featuring Brad Griffin from Cadence Design Systems, discussing SI and PI in the realm of intelligent system design.
IMI Welcomes New CEO
05/03/2024 | IMIIntegrated Micro-Electronics, Inc. (IMI),The IMI Board of Directors announced, in a disclosure dated April 25, 2024, the appointment of Louis Sylvester Hughes, Chief Executive Officer (CEO).
Gstar Announced the Strategic Move: Groundbreaking of Silicon Wafer Factory Construction in Indonesia
05/03/2024 | PRNewswireRecently, Gstar held a groundbreaking ceremony for its silicon rod and silicon wafer factory, marking the beginning of the rapid construction phase.
ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series
05/01/2024 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges.
On the Line With… Talks With Cadence Expert on SI/PI for PCB Designers
05/02/2024 | I-Connect007In “PCB 3.0: A New Design Methodology—SI/PI for PCB Designers,” subject matter expert Brad Griffin, Cadence Design Systems, discusses how an intelligent system design methodology can move some signal and power integrity decision-making into the physical design space, offering real-time feedback.