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We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
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Why You Should Attend IPC APEX EXPO 2018
February 6, 2018 | IPCEstimated reading time: 1 minute
The IPC APEX EXPO 2018 is just weeks away. To be held from February 24 to March 1 at the San Diego Convention Center in California, USA, the event has continuously hosted many visitors from the electronics manufacturing industry all around the world.
Here are the top three reasons attendees have indicated why they attend IPC APEX EXPO, and why you should, too.
1. Education you can only get by attending IPC APEX EXPO.
The world's premier Technical Conference: Education that teaches the practical. Stringently vetted content that's never been presented elsewhere; we deliver the latest research and innovations from subject matter experts in the areas of board fabrication and design, and electronics assembly.
Professional Development Courses to boost your career: Get up to speed on the latest in design, materials, process improvement, solder joint reliability and more with over 30 courses delivered by corporate technologists, consultants, training center staff and university faculty.
Design Forum: Some of the industry's most distinguished experts deliver design-focused education on the hottest topics such as Printed Circuit Board 4.0 and Key Design Considerations that impact cost & affect manufacturability of PCBs.
Buzz Sessions: Get key insights on the hot industry trends such as 3D Printed Electronics, Industry 4.0 and E-Textiles - topics that point the way toward tomorrow.
2. Build a network that takes you in new directions.
Connect with thousands of your electronics industry peers from around the globe in sessions, on the exhibit show floor, at dinner, lunch or breakfast. Find valuable networks that improve your company's performance, further your personal success, make new connections and strengthen existing relationships.
3. Experience the largest collection of industry suppliers all under one roof.
Explore and compare equipment from more than 470 of the industry's top suppliers. Discover new processes to gain greater efficiency. Find new suppliers to save you both time and money and uncover new solutions that will help you deliver at the velocity of technology.
To register, click here.
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05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
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Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
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