AT&S Expands Global Competence for Autonomous Driving
February 13, 2018 | AT&SEstimated reading time: 1 minute

Autonomous driving and the already existing applications in this area have great potential for the microelectronics industry. The printed circuit board market for these applications is growing by roughly 5.5% annually; by 2020, the electronic components are expected to account for a share of 35% of the cost of cars, and even 50% by 2030 (Source: Statista 2018). With printed circuit boards for driver assistance systems such as distance measurement, lane change assistance and navigation systems, AT&S has already positioned itself as a technology leader at an early stage in the past.
Now AT&S is expanding its technology competence with an investment project of roughly EUR 40 million and will produce high-frequency printed circuit boards for applications which are used, for example, in sensors for distance measurements at the existing sites in Nanjangud, India (near Bangalore) and Fehring, Austria (South East Styria) starting in May 2018 (India) and March 2019 (Fehring). Both plants will continue to expand the relevant competences in close coordination and in synergy.
The new capacities will contribute to increases in revenue and earnings in the Automotive segment, which currently accounts for 33% of the Group’s total revenue together with the Industrial and Medical segments. CEO Andreas Gerstenmayer said: “We were one of the pioneers in HDI technology in the automotive sector and with this expansion we intend to consolidate our position in the future. This step is fully in line with our strategy to generate growth through technology. This is a significant technology leap for both sites. As a result, we will continue to be the technology leader in India as well, far ahead of the competition. We consider India a very lucrative future market for us.”
For autonomous driving, great volumes of complex data have to be transferred securely in split seconds. These advanced applications require high-frequency printed circuit boards, which not only serve as a connection platform for the electronic components, but also exercise the functions of antennas and filters, for example. AT&S is globally leading in this area and has developed printed circuit boards which deliver the necessary performance in the frequency range up to 80 GHz. These technologies provide the basis for powerful radar components (long-range radar with 77/79 GHz) in driver assistance systems and are thus an indispensable prerequisite for autonomous driving.
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.