Trouble in Your Tank: Understanding Interconnect Defects, Part 1
It’s Only Common Sense: Marketing Isn’t Fluff, It’s Ammunition
Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
Cirexx Purchases Third DI system from Technica USA
February 23, 2018 | Technica USAEstimated reading time: 2 minutes
Technica USA reported that Cirexx International, Inc of Santa Clara, California purchased their third CBT/MLI DI system recently. This unit will be displayed at the upcoming IPC APEX EXPO in San Diego.
Phil Menges, President of Cirexx stated, “Our business keeps growing and it is requiring us to expand our capacity and capabilities. One of the areas we needed to expand was in Imaging. Our focus and efforts were to become 100% DI dependent. DI imaging technology has made some dramatic improvements to the consistency, quality and efficiency of our PCB manufacturing operation and we are very pleased to have standardize our DI platform on the CBT/MLI technology. The equipment has proven to be reliable and fully capable of meeting our printing needs for innerlayer, outer layer and solder mask. What I am most impressed with is that CBT continues to advance their technology at a rapid pace, keeping up on the technological demands placed on our industry”.
Frank Medina, President of Technica USA, stated, “Technica and CBT appreciates the faith that Cirexx has placed in our two companies. They have made a major investment to stay on the leading edge in technology. We are pleased to have been given the opportunity to work closely with them to ensure they get the full benefit of their investment.”
Mr. Menges concluded, “Technica USA is a major supplier to Cirexx because of the level of support they provide to our company each and every day. Our recent purchase of the third CBT/MLI DI is a testament to the technology, performance and the support we have experienced.”
About Cirexx Inc.
Founded in 1980, Cirexx International, Inc. is an electronic solutions company offering PCB design, PCB fabrication and PCB assembly of high-reliability printed circuit boards, RF/microwave circuit boards, flexible printed circuits and rigid-flex circuit boards. Recognized as a time-technology leader, the company offers a genuine quick turn service and provides a one stop shop and all in-house solution known as seamless integration. Cirexx has expertise fabricating high layer count printed circuit boards using a variety of substrates including a wide array of high-frequency RF-based materials in mixed (hybrid) constructions. Cirexx delivers unsurpassed quality and support to a large array of customers in the high-reliability markets of defense/aerospace, industrial, and medical instrumentation. For more information, click here.
About Technica USA
Technica, USA provides the highest quality equipment and process materials, manufactured worldwide, for the printed circuit board fabrication and assembly markets as well as the microelectronic, photovoltaic and printed electronics markets. For more information click here.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.