It’s Only Common Sense: Invest in Yourself—You’re Your Most Important Resource
Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
Atotech Launches New Horizontal Bonding Enhancement Solution for HF Applications
April 26, 2018 | AtotechEstimated reading time: 2 minutes
BondFilm HF is Atotech’s new process for the treatment of inner layer cores. It leads to highest bonding performance in the manufacture of multilayer & HDI printed circuit boards. This innovative new process maintains the excellent performance first developed in the BondFilm product range whilst offering the lowest possible signal loss as required in high frequency applications.
Circuit design is already planning towards the low signal loss requirements of the next generation of network technology, the so called 5G. To meet these signal integrity demands the ideal would be to use a non-etching adhesion promotor system. However, whilst such systems are available in the market, they are not yet widely established. BondFilm HF bridges the gap with significantly reduced surface roughening which helps meet the signal integrity requirements whilst maintaining excellent bond strength and functional performance.
BondFilm HF
The latest development in Atotech’s BondFilm product range is BondFilm HF. Copper panels treated with BondFilm HF have the typical uniform, brown organo-metallic coating long associated with the BondFilm® process. This coating retains the excellent enhanced bonding between the inner layer and prepregs used in multilayer manufacture but with one significant difference: only minimal roughening is needed.
In previous versions of the BondFilm process development targets have been to maximize the surface roughening to give the best possible multilayer bond strength; here, the target was to provide this functional performance without compromise but with a minimal roughening of the copper traces. By producing this low roughening of the copper surface a significant reduction in signal loss in the „skin“ of the copper traces is achieved. This makes BondFilm HF more suited to high frequency applications where signal integrity is paramount.
Production trials using BondFilm HF focused on the functional properties of the multilayer boards together with electrical signal loss measurements. Data shows that panels manufactured with BondFilm HF fulfill all reliability tests considered, such as thermal stress tests and performance multiple iR reflow cycles. At the same time they significantly outperform panels made with conventional treatment processes in terms of reduced signal loss.
BondFilm HF is a simple drop in replacement for existing BondFilm process users. Its short process sequence is also compatible with most existing oxide alternative lines.
The process is already installed in a leading Chinese manufacturer and shows excellent results with first customer evaluations. Its key benefits in terms of significantly reduced signal loss gives this new process a considerable advantage for all high frequency applications.
About Atotech
Atotech is one of the world’s leading manufacturers of specialty chemicals and equipment for the printed circuit board, IC-substrate and semiconductor industries, as well as for the decorative and functional surface finishing industries. Atotech has annual sales of USD1.2 billion (2017). The company is fully committed to sustainability – we develop technologies to minimize waste and to reduce environmental impact. Atotech has its headquarters in Berlin, Germany, and employs about 4,000 people in over 40 countries. About a quarter of all staff works in one of the four locations in Germany: Berlin, Feucht, Neuruppin, and Trebur. For more information, click here.
Share on:
Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.