-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current Issue
The Legislative Outlook: Helping or Hurting?
This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Arlon EMD Achieves IPC’s QPL Certification for 12 Products
June 11, 2018 | Arlon EMDEstimated reading time: 1 minute
Arlon Electronic Materials is pleased to announce that IPC's Validation Services Program has extended the IPC-4101E Qualified Products Listing (QPL) to seven more polyimide products.
Arlon produces and sells military-grade, copper-clad laminates, prepregs and packaging substrates to the global electronics industry. Arlon successfully qualified their products 85N, 35N, 84N, 85HP and 33N to polyimide specification sheet 40 and 41 of IPC-4101E, Specification for Base Materials for Rigid and Multilayer Printed Boards. For polyimide specification sheet 42, Arlon submitted and passed with products 37N and 38N. Arlon also completed an intensive two-day audit in February 2018 where their manufacturing practices, test methods and IPC-4101 conformance requirements were reviewed.
Arlon met or exceeded IPC’s Validation Services QPL requirements for producing base materials used by printed circuit board manufacturers in the military electronics industry. The company is now listed as an IPC-4101 trusted source capable of manufacturing in accordance with industry best practices for specification sheets 40, 41 and 42.
Arlon President Brad Foster said, “IPC’s offering of validation services to the industry is an important first step to informing OEMs and fabricators which materials IPC has qualified. Because of Arlon’s long-standing history of supplying tried and proven products into military, avionic and space applications, we felt it was important for us to meet IPC’s QPL requirements for IPC-4101 on slash sheets 40, 41 and 42. Arlon is the only laminator to date, to gain IPC’s QPL recognition with all three polyimide slash sheets. Meeting IPC’s QPL requirements reaffirms to our customers that they can trust in the products they purchase from Arlon.”
Arlon now has the following products QPL listed:
For IPC-4101/40: 85N, 33N, 35N, 84N, 85HP
For IPC-4101/41: 85N, 33N, 35N, 84N, 85HP
For IPC-4101/42: 37N, 38N
IPC's Validations Services QPL/QML Program was developed to promote supply chain verification. It also provides auditing and certification of electronics companies' products and identifies processes which conform to IPC standards.
Arlon EMD can be found on IPC's QML/QPL database, click here.
About Arlon
Arlon EMD is a privately held, veteran owned, US manufacturer and distributor of specialty materials. Arlon has supplied materials for the N. American, UK and European markets for more than 25 years from their manufacturing location in Rancho Cucamonga, California.
For additional information, please visit our website.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
WestDev Announces Advanced Thermal Analysis Integration for Pulsonix PCB Design Suite
10/29/2025 | WestDev Ltd.Pulsonix, the industry-leading PCB design software from WestDev Ltd., announced a major enhancement to its design ecosystem: a direct interface between Pulsonix and ADAM Research's TRM (Thermal Risk Management) analysis software.
Designers Notebook: Power and Ground Distribution Basics
10/29/2025 | Vern Solberg -- Column: Designer's NotebookThe principal objectives to be established during the planning stage are to define the interrelationship between all component elements and confirm that there is sufficient surface area for placement, the space needed to ensure efficient circuit interconnect, and to accommodate adequate power and ground distribution.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
Nolan’s Notes: Tariffs, Technologies, and Optimization
10/01/2025 | Nolan Johnson -- Column: Nolan's NotesLast month, SMT007 Magazine spotlighted India, and boy, did we pick a good time to do so. Tariff and trade news involving India was breaking like a storm surge. The U.S. tariffs shifted India from one of the most favorable trade agreements to the least favorable. Electronics continue to be exempt for the time being, but lest you think that we’re free and clear because we manufacture electronics, steel and aluminum are specifically called out at the 50% tariff levels.
MacDermid Alpha & Graphic PLC Lead UK’s First Horizontal Electroless Copper Installation
09/30/2025 | MacDermid Alpha & Graphic PLCMacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is proud to support Graphic PLC, a Somacis company, with the installation of the first horizontal electroless copper metallization process in the UK.