-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
Fueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Flex Time: Why is Rigid-Flex So Expensive?
July 11, 2018 | Bob Burns, PRINTED CIRCUITSEstimated reading time: 1 minute

One question that I hear fairly often, particularly after an initial quotation, is “Why is rigid-flex so expensive?” In this article, I’ll share with you the cost drivers in rigid-flex relative to standard rigid boards and flex circuits with stiffeners. A typical rigid-flex PWB will cost about seven times the cost of the same design on a hard board, and two to three times an equivalent flex circuit with stiffeners. A good way to estimate the cost of rigid-flex board in low-level production quantities is 35 to 40 cents per square inch, per layer. So, if you have an eightlayer board that measures 4” x 6”, your costing would look like this:
8 layers x 4” x 6” x $0.40/sq.in. = $ 76.80 each
Again, this applies only to low level production quantities. This is a helpful calculation for getting a quick, rough idea of what your part might cost as a rigid-flex. Rigid-flex PWBs cost quite a bit more, primarily because of the higher cost of the raw materials we use to build them, relative to standard rigid boards or even flex boards. The number one cost driver is the no-flow prepreg. Rigid-flex manufacturers have to use no-flow, or sometimes low-flow prepreg, so that the resin does not flow out onto the flexible areas of the board. No-flow prepregs are designed to offer just enough flow to fill the circuits in the hardboard areas, but not enough to flow out onto the flexible areas of the boards.
No-flow and low-flow prepregs run from $1.50 to $3 per square foot. Conventional rigid board high-flow prepregs run around $.25 per square foot, so there is a large differential in price just for the prepreg. A couple of other things contribute to the cost as well. No-flow prepreg is only available in 1080 and 106 glass cloth styles, which typically press out at .0025” and .002” respectively, so they are thin. Rigid-flex manufacturers don’t have 2113, 2116, 7628 glass styles available to manufacture your board. It is wise to use two plies of prepreg between layers within your construction. The no-flow resin resists flowing, so to assure adequate fill, we use two plies of prepreg between each layer.
To read the full version of this article which appeared in the April 2018 issue of Flex007 Magazine, click here.
Suggested Items
Automotive Sector Poised for Major Shifts Amid EV Expansion and Fiercer Competition
03/18/2025 | PRNewswireThe global automotive industry is undergoing a significant transformation, with 2025 poised to bring new developments influenced by key events in 2024. As automakers navigate evolving market conditions, strategic partnerships, electrification, and the rise of new manufacturing hubs will be central to industry growth.
TI Introduces the World's Smallest MCU, Enabling Innovation in the Tiniest of Applications
03/12/2025 | PRNewswireTexas Instruments (TI) introduced the world's smallest MCU, expanding its comprehensive Arm® Cortex®-M0+ MSPM0 MCU portfolio. Measuring only 1.38mm2, about the size of a black pepper flake, the wafer chip-scale package (WCSP) for the MSPM0C1104 MCU enables designers to optimize board space in applications such as medical wearables and personal electronics, without compromising performance.
indie Semiconductor and GlobalFoundries Announce Strategic Collaboration to Accelerate Automotive Radar Adoption
03/12/2025 | GlobalFoundriesindie Semiconductor, an automotive solutions innovator, has announced a strategic collaboration with GlobalFoundries (Nasdaq: GFS) (GF) to develop its portfolio of high-performance radar systems-on-chip (SoC).
Air Taxis Poised for Mass Adoption as Honeywell Survey Highlights Consumer Interest
03/06/2025 | HoneywellHoneywell released new survey results showing nearly all U.S. airline fliers (98%) would consider taking an electric vertical take-off and landing vehicle, or eVTOL, as part of their travel journey
Mycronic Receives Order for Prexision Lite 8 Evo
02/27/2025 | Mycronic ABMycronic AB has received a replacement order for a Prexision Lite 8 Evo from an existing customer in Asia. The order value is in the range of US$8-10 million.