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The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
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Summer Issue of Flex007 Magazine Available Now
July 25, 2018 | Andy Shaughnessy, Flex007 MagazineEstimated reading time: Less than a minute
An increasing number of OEMs are being forced into using flexible and rigid-flex circuits, for a variety of reasons: Sometimes rigid boards won’t fit the shrinking enclosures anymore, or the companies just need rugged, reliable circuits.
In the July 2018 issue of Flex007 Magazine, our contributors discuss some of the hurdles they faced when they dove into flex and rigid-flex circuits, and they offer advice to anyone considering a move into the flexible arena.
Check it all out this month in Flex007 Magazine, now on the virtual newsstand and available for delivery in your e-mailbox each month by subscribing here.
Be sure to download the PDF copy or future reference. The PDF is great for beach reading!
Suggested Items
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Real Time With... IPC APEX EXPO 2025: Best Student Technical Paper Winner—Attila Rektor
04/10/2025 | Marcy LaRont, I-Connect007Attila Rektor, a Ph.D student from Boise State, won the best technical paper award at IPC APEX EXPO 2025. His paper explores enhancing the conductivity of laser-induced graphene for flexible circuits. The research, funded by SAIC, involved modulating surface energy to enable effective copper plating. This breakthrough has potential applications in flexible printed circuit boards, sensing, and biomedical devices.
Real Time with... IPC APEX EXPO 2025: Advancements for Flexible Circuit Technologies
04/11/2025 | Real Time with...IPC APEX EXPOMark Finstad and Chris Clark from Flexible Circuit Technologies discuss their new marketing campaign for catheter circuits, featuring larger formats and advanced specifications. They explain the development of in-house materials for high-density circuits, enhancing cost competitiveness. They highlight the opening of a new facility in China for advanced assembly services, along with focused training sessions to fill industry education gaps and promote early customer engagement for better project outcomes.
CEE PCB Appoints Markus Voeltz to Business Development Director Europe
04/02/2025 | CEE PCBCEE PCB, a leading manufacturer of printed circuit boards (PCBs) and flexible printed circuits (FPCs) with 3 production facilities in China, is expanding its presence in Europe and began providing local support in March 2025. With 25 years of experience in the industry, the company is enhancing its commitment to European customers by providing more direct collaboration for technical inquiries and advice.
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
03/26/2025 | Joe Fjelstad -- Column: Flexible ThinkingThis month, I will discuss the most common design errors that fabricators see, typical areas of miscommunication between design and fabrication, and what designers can do to avoid putting their jobs on hold. This is no simple task, given the many things that can go wrong in flex circuit manufacturing, but many of these issues originate in the design process.