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BEX Introduces New Line of Nozzles
September 18, 2018 | BEXEstimated reading time: Less than a minute
BEX, a manufacturer of nozzles and eductors for manufacturing and maintenance applications, introduces a line of high-performance replacement nozzles engineered specifically for board shops and manufacturers of electronic wafers for microchips.
This BEX nozzle series includes 2 main categories of nozzles, each available in a wide variety of flow rates and angles, and each designed for maximum coverage and lowest fresh water consumption.
BEX Flat Fan Rinsing Nozzles, manufactured primarily from polypropylene or PVDF, (stainless steel is also available) are engineered for final rinses and are available in “water saver” models as low as .2 gpm. BEX Full Cone Nozzles are designed primarily for etching chambers and recirculated and final rinses; their pattern consists of multiple concentric hollow cones that together create the full cone effect with a small droplet size. In addition to nozzles, BEX manufactures eductors for use in copper plating and cleaning tanks.
To insure the best customer outcomes, Bex provides expert applications assistance for OEMs and board shops, M-F, from 8-5 EST. The company maintains a large inventory and has the industry’s fastest and most streamlined ordering process.
Suggested Items
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
05/09/2025 | Michael Carano -- Column: Trouble in Your TankIn the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
04/15/2025 | Michael Carano -- Column: Trouble in Your TankThere are numerous factors at play in the science of electroplating or, as most often called, electrolytic plating. One critical element is the use of organic addition agents and their role in copper plating. The function and use of these chemical compounds will be explored in more detail.
IDTechEx Highlights Recyclable Materials for PCBs
04/10/2025 | IDTechExConventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.