It’s Only Common Sense: Invest in Yourself—You’re Your Most Important Resource
Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
Alun Morgan Named Technology Ambassador for Ventec
September 19, 2018 | Ventec International GroupEstimated reading time: 1 minute
Ventec International Group Co., Ltd. announced that Alun Morgan, chairman of the EIPC, has been named technology ambassador for Ventec International Group. In support of a common mission to promote the next generation’s progress in PCB material design, Alun will apply his extensive background and expertise in advocating for the Taiwan stock exchange listed company as an advisor and ambassador.
One of Alun's first public appearances in his new role as Technology Ambassador for Ventec will be at the 11th CTI Symposium in Munich (November 22-23, 2018) with a presentation titled 'Hot Cars, cool electronics… Thermal Management Materials for Automotive Electronics'.
Alun continues to serve as the chairman of The European Institute for the PCB Community (EIPC) and holds the posts of director and trustee of the charity Scottish Autism.
He began his career as a research investigator at the Institute of Physics' Fulmer Research Institute in the UK and after serving as technical manager of a PCB manufacturer, he joined PCB materials supplier MAS Electronics going on to become UK general manager. Following the acquisition of MAS by Isola, he joined the Isola management team serving as a director and corporate vice-president of Operations and Engineering of the Isola Group worldwide.
Alun holds a B.Sc. Honors degree in Metallurgy from the Department of Materials Science and Engineering at the University of Surrey, is an associate of the University of Surrey and a Fellow of the Institute of Circuit Technology.
"I am excited to work with an organization whose strong reputation and global recognition as a leading materials supplier is built upon its innovative culture and unique & proven product development capabilities," said Alun of his new role.
"I can't think of a more perfect ambassador for Ventec than Alun. He is highly networked & respected in the industry and widely acknowledged as a PCB expert. His experience and entrepreneurial flair will be of great benefit to Ventec as we journey through our most exciting period of development for the Group," Mark Goodwin, Ventec's COO Europe and Americas, added.
About Ventec International Group
With volume manufacturing facilities and Headquarters in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, click here.
Share on:
Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.