It’s Only Common Sense: Invest in Yourself—You’re Your Most Important Resource
Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
Atotech to Exhibit and Present at TPCA and IMPACT Conference
October 22, 2018 | AtotechEstimated reading time: 2 minutes
Atotech announced its participation at this year’s TPCA Show and IMPACT Conference 2018 at the Taipei Nangang Exhibition Center in Taipei, Taiwan from October 24 to 26. The company’s booth will be prominently located at the TPCA Show floor (booth number K818) and will highlight latest solutions for (a)mSAP, mobile and 5G PCB manufacturing, among several others. Representatives from Atotech Taiwan and Atotech Group will be on-site to meet clients, prospects and partners.
Besides the TPCA Show, Atotech is also well represented at this year's IMPACT Program with the following presentations:
On Wednesday, October 24, from 4:00 to 4:15 p.m. in Room 503, Bert Reents, global product director for electrolytic copper plating at Atotech Group, will present “Filling of Microvias and Through Holes by Electrolytic Copper Plating - Current Status and Future Outlook”. Bert will discuss the dimensions of microvias and through holes which can be filled with electrolytic copper processes today. “Copper filling technologies display clear benefits over paste plugging technologies,” states Bert. “Besides today’s more common applications, I will also highlight Atotech's status on Panel Level Packaging (PLP)."
On Thursday, October 25, from 4:00 to 4:15 p.m. in room 503, Sandra Nelle, global product manager for surface finishing at Atotech Group, will elaborate on whether or not a cyanide-free gold bath can perform adequately in a high volume manufacturing environment. “I will present a cyanide-free gold plating solution which was tested on a mid-phosphorous flex nickel bath,” says Sandra. She will establish that this eco-conscious cyanide-free gold bath is a feasible option for flexible printed circuit board manufacturing.
Figure 1: Showing Atotech’s Inpulse 2THF process performing “X-plating and BMV filling” to realize a uniform bridge plating and through hole filling - a patented plating technology by Atotech
Visitors to the show are invited to attend both presentations at IMPACT Conference and stop by at booth K818 at TPCA Show, any time from October 24 to 26. Other show highlights include, Cupracid AC and PallaBond. Cupracid AC is one of Atotech’s high productivity processes specifically qualified for automotive production and a wide range of vertical conveyorized systems (VCP) as well as hoist type equipment. PallaBond is a universal final finish for maximum fine feature resolution and definition. It enhances high-frequency design and is universally applicable for high-end circuitry.
About Atotech
Atotech is one of the world’s leading manufacturers of specialty chemicals and equipment for the printed circuit board, IC-substrate and semiconductor industries, as well as for the decorative and functional surface finishing industries. Atotech has annual sales of USD1.2 billion (2017). The company is fully committed to sustainability – we develop technologies to minimize waste and to reduce environmental impact. Atotech has its headquarters in Berlin, Germany, and employs about 4,000 people in over 40 countries. For more information, click here.
Share on:
Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.