The Marketing Minute: Marketing With Layers
The Right Approach: Electro-Tek—A Williams Family Legacy, Part 1
It’s Only Common Sense: If You’re Not Differentiated, You’re Dead
Flex Talk: Additive Electronics—PCB Scale to IC Scale
October 26, 2018 | Tara Dunn, OMNI PCBEstimated reading time: 1 minute
SAP, mSAP, SLP—what kind of crazy acronyms have we adopted now, and how much do you really need to know? In terms of consumer electronics, there is a good chance that the smartphone attached to your hand at all times contains a PCB fabricated with this technology—or at the very least, the next-generation smartphone that you purchase will utilize mSAP technology. In terms of current-day PCB design and fabrication, that really depends on where you are now with technology. The standard subtractive-etch process serves the industry well. Developments in materials, chemistry and equipment enable the traditional PCB fabrication process to achieve feature sizes such as line and space down to 30 microns. Larger shops with more sophisticated capabilities are building this technology today. Mainstream PCB manufacturing is often limited to 50-75 microns (µm) line and space. But the electronics industry is evolving quickly. Propelled by the demand for more sophisticated electronics, the PCB design is being tasked with finer lines, thinner materials and smaller via sizes. A traditional progression is to first move to HDI technology with microvias and multiple lamination cycles for fabrication. Today’s mSAP and SAP technology offers an advanced approach, with line and space capabilities of less than 25 microns, to meet these exceedingly complex design requirements.
A Few Definitions
- Subtractive etch process: commonly used to fabricate printed circuit boards. This process begins with copper-clad laminate, which is masked and etched (copper is subtracted) to form traces
- Additive PCB fabrication: this process utilizes additive process steps, rather than subtractive process steps to form traces
- SAP: semi-additive process, adopted from IC fabrication practices
- mSAP: modified semi-additive process, adopted from IC fabrication practices
- SLP: substrate-like PCB; a PCB using mSAP or SAP technology instead of subtractive etch technology
To read the full version of this article which originally appeared in the September 2018 issue of PCB007 Magazine, click here.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
NextFlex Announces New Affiliated Alabama ‘Node’ to Support Growing National Hybrid Electronics Community
10/16/2025 | PRNewswireNextFlex®, America's Hybrid Electronics Manufacturing Innovation Institute, announced the launch of a new Alabama Node. The Alabama Node will accelerate the commercialization of hybrid electronics by boosting innovation, technology transition, and adoption.
NOTE Posts Interim Report Q3 2025
10/16/2025 | NOTE ABNOTE AB reported renewed growth and continued strong profitability in Q3 2025, with sales rising to SEK 830 million and an adjusted operating margin of 9.3%.
RT-Labs Joins STMicroelectronics Partner Program to Accelerate Industrial Communication
10/16/2025 | RT-LabsRT-Labs, a leading provider of real-time software solutions for industrial automation, announces that it has joined the STMicroelectronics Partner Program to integrate its Ethernet-based industrial communication stacks into ST’s development environments and microcontroller platforms.
Our Legislative Outlook: PCB007 Magazine October 2025 Issue
10/16/2025 | I-Connect007 Editorial TeamMost agree that we are experiencing an unprecedented time in global business and economics, with rules and laws that open doors to business but can complicate operations and make profitability more challenging. This month, PCB007 Magazine features some of today’s leading experts on legislative issues affecting the electronics industry, including rules and laws, trade, sustainability, business expansion, grants, and more in the U.S., Europe, and China.
Foxconn's Rotating CEO, Yang Qiujin, Named One of Asia's Most Influential Women
10/15/2025 | Foxconn ElectronicsHon Hai Precision Industry Co., Ltd.'s management team has once again received recognition! Rotating CEO Kathy Yang has been named to Fortune magazine's " Most Powerful Women Asia 2025 " list of the 100 most influential women in Asia , achieving a remarkable fifth place in her debut.