Standard of Excellence: Turning Negative Customer Feedback Into Positive Outcomes
Smart Automation: The Growing Role of Additive Manufacturing
Global Citizenship: Redefining Connection and Responsibility in Digital Transformation
EMS Installs Second MEK AOI Machine
December 18, 2018 | Electronic Manufacturing Solutions Ltd (EMS)Estimated reading time: 1 minute
Electronic Manufacturing Solutions Limited (EMS) has installed a new MEK PowerSpector GTAz+GDAz 550BTL CE 9 Camera inline AOI machine.
The PowerSpector GTAz+GDAz 550BTL contains one off 18.75u HD Camera with telecentric optics and eight off 10u side cameras for side and edge inspection of components. The omnidirectional multi angle, multi-colour LED lighting provides class leading assessment of the solder meniscus and the capability to test a range of criteria on all types of solder joints.
“I am very pleased with the investment in our PowerSpector GTAz+GDAz 550BTL, the additional capacity it brings along with its class leading optics. This is another significant step in the company’s growth”, said Bernard Chubb, managing director of EMS.
This will enable us to increase capacity dramatically, we look forward to being able to provide increased customer satisfaction through this additional resource whilst continuing with industry-leading turnaround times and exceptional levels of quality,” said EMS’ Sales Manager Rob Moore.
“The PowerSpector GTAz+GDAz 550BTL is a critical investment in keeping pace with the increasing miniaturisation and complexity with the class leading optics, software and support being critical to the EMS selecting MEK.”, said Jonathan Plummer, General Manager of EMS. “The MEK PowerSpector GTAz+GDAz 550BTL contains two camera, top and bottom, which are able to inspect both sides of an assembly in one process, be it double sided surface mount only or surface mount and through hole”.
Share on:
Suggested Items
INEMI Call-for-Participation Webinar: BiSn-Based Low-Temperature Soldering Process and Reliability Project Phase 3b
04/28/2025 | iNEMIIn 2015, INEMI initiated the BiSn-Based Low-Temperature Soldering Process and Reliability Project to assess the feasibility of using low-temperature solders (LTS) in the SnBi system to address various technological, economic and ecological drivers for assembly of consumer computer electronic board products.
KYZEN to Feature Stencil Cleaning and Aqueous Cleaners at SMTA Capital Expo and Tech Form
04/28/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Capital Expo and Tech Forum, scheduled to take place Thursday, May 8 at George Mason University – Mason Square in Arlington, VA.
KYZEN Focuses on Aqueous Cleaning and Stencil Cleaning at SMTA Wisconsin
04/24/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Wisconsin Expo and Tech Forum, scheduled to take place Tuesday, May 6 at the Crowne Plaza Milwaukee Airport. KYZEN will be on-site to provide attendees with information about aqueous cleaning chemistry AQUANOX A4618 and stencil cleaner KYZEN E5631J.
SMTA Bridging the Skills Gap in Arizona
04/24/2025 | Marcy LaRont, I-Connect007One area where SMTA really excels is through its local chapters. On April 16, 2025, I-Connect007's Marcy LaRont attended the Workforce Breakfast during the SMTA Arizona Expo & Tech Forum in Mesa, which featured more than 50 electronics professionals from the local area, including defense OEMs, and others who were attending for the first time. Blackfox and Hyrel Technologies sponsored the event. The keynote presentation featured Sean Denny, a professor at Estrella Mountain Community College, who emphasized a clear need for skilled hand soldering technicians.
IPC Releases Version 2.0 of IPC-2591, Connected Factory Exchange, with Expanded Device Coverage and Smarter Data
04/23/2025 | IPCIPC announces the release of IPC-2591, Connected Factory Exchange (CFX), Version 2.0, the global standard for plug-and-play, machine-to-machine, and machine-to-system communication for digital manufacturing.