It’s Only Common Sense: Marketing Isn’t Fluff, It’s Ammunition
Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
Best Technical Paper at IPC APEX EXPO 2019 Selected
December 18, 2018 | IPCEstimated reading time: 1 minute
The best technical conference paper of IPC APEX EXPO 2019 has been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Program Committee, the paper authors will receive their awards during the opening keynote session on Tuesday, January 29, 2019.
Taking top honors, the winning paper is, “Reducing Dust Deposition on Electronic Equipment by Optimizing Cooling Air Flow Patterns” by Chen Xu, Nokia. His co-author was: Jason Stafford, Imperial College London. This paper will be presented during Technical Conference Session 36 (Surface Finish Reliability/ Gold Brush Plating Repair/ Creep Corrosion) on Thursday, January 31.
This year, two papers were selected in the honorable mention category. Honorable mention went to, “Head-on-Pillow Defect Detection – X-ray Inspection Limitations” by Lars Bruno, Ericsson AB. His co-author was: Benny Gustafson, Ericsson AB. This paper will be presented during Technical Conference Session 3 (Assembly/Inspection -- BTC/ BGA) on Tuesday, January 29.
Honorable mention also goes to “Analyzing a Printed Circuit Board with Oxide Residue Contamination” by Wade Goldman, The Charles Stark Draper Laboratory, Inc. His co-authors were: Andrew Dineen; Hailey Jordan; Curtis Leonard, The Charles Stark Draper Laboratory, Inc.; and Edward Arthur, Raytheon Company, Space and Airborne Systems. This paper will be presented during Technical Conference Session 25 (Failure Analysis) on Wednesday, January 30.
The papers were evaluated on their technical content, originality, test procedures and data used to deduce conclusions, quality of illustrations and the clarity and professionalism of writing as well as value to the industry.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
TTM Technologies Receives Two Awards from the Global Electronics Association at the 2025 IPC CEMAC Conference
11/03/2025 | Globe NewswireTTM Technologies, Inc. announced that two of its team members received prestigious Asia Steering Committee Outstanding Service Awards from the Global Electronics Association (formerly named IPC connecting global electronics industry) at the 2025 IPC CEMAC Electronics Manufacturing Annual Conference in Shanghai.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.