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Current IssueThe Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
Fueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
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IPC Commends Passage of FIRST STEP Act
December 19, 2018 | IPCEstimated reading time: Less than a minute
John Mitchell, president and CEO of IPC issued the following statement on the U.S. Senate’s vote this week to enact a criminal justice reform bill called the FIRST STEP Act.
“IPC applauds the U.S. Senate for coming together in a bipartisan manner to address criminal justice reform with the passage of the FIRST STEP Act, which includes an important provision to build up the high-tech workforce while reducing recidivism. Specifically, the bill calls for partnerships with schools and industry organizations to offer vocational training and certifications to help inmates transition into the workforce. Providing more workforce development opportunities in the electronics industry is among IPC’s top priorities, and thus we look forward to continuing to work with governments and partners at all levels to implement this provision.”
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
03/14/2025 | Nolan Johnson, I-Connect007Inside the industry, it feels like we’re getting ready for a big party holiday, and I’m feeling the whole Mardi Gras vibe. This weekend, IPC APEX EXPO kicks off with standards development committees and the Technical Conference before the Expo starts on March 18. We’ll be sneaking out of our network of evil lairs scattered around North America and convening at the I-Connect007 booth in the middle of the Anaheim Convention Center. Be sure to stop by and say hello.
SEMI Europe Recognizes NXP and Okmetic Leaders for Their Impact on the Semiconductor Industry
03/14/2025 | SEMISEMI Europe announced the winners of the SEMI European Award and Special Service Award for 2024 at the SEMI Industry Strategy Symposium Europe (ISS Europe) 2025. Kurt Sievers, President and CEO of NXP Semiconductors, was honored with the SEMI European Award and Anna-Riikka Vuorikari-Antikainen, Chief Commercial Officer of Okmetic, received the Special Service Award.
Intel Appoints Lip-Bu Tan as Chief Executive Officer
03/13/2025 | Intel CorporationIntel Corporation announced that its board of directors has appointed Lip-Bu Tan, an accomplished technology leader with deep semiconductor industry experience, as chief executive officer, effective March 18.
IMAPS and DPC: 21 Years of Elevating Technical Knowledge
03/13/2025 | Marcy LaRont, I-Connect007The IMAPS 21st Device Packaging Conference (DPC) may have taken place at a conference center located down an idyllic desert road showcasing the best of what native Arizona has to offer, but the topics at this conference were anything but laid-back. This important platform for professionals in microelectronics and advanced packaging set the stage for a technology in high demand. Brian Schieman, IMAPS executive director, says the show was organized to demonstrate their commitment to addressing current technological trends and with significant energy directed toward fostering connections within the supply chain.
KYZEN Announces the Retirement of Longtime Executive Vice President Tom Forsythe
03/13/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, announces the retirement of Tom Forsythe, Executive Vice President, effective December 31, 2024, after more than three decades of service to the company and the electronics manufacturing industry.