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Top 10 Most-Read MilAero News
December 26, 2018 | I-Connect007Estimated reading time: 2 minutes

1. Elbit Systems Wins $17M Electronic Warfare Contract
Elbit Systems Ltd. announced today that it was awarded an approximately $17 million contract from a European country to supply a range of advanced ground-based Electronic Warfare (EW) and Signal Intelligence (SIGINT) systems. The contract will be performed over a two-year period.
2. PDR Joins Forces with USM Reps in Mexico
PDR has partnered with USM Reps its manufacturers’ representative. Eduardo Ortiz will represent PDR’s IR rework systems throughout Mexico (excluding Baja), the Central America region and El Paso, Texas.
Lockheed Martin and Cobham are joining forces for the Next Generation Jammer Low Band (NGJ-LB) competition to replace the U.S. Navy's ALQ-99 tactical jamming system currently on the E/A-18 Growler aircraft.
4. IPC Volunteers Honored for their Contributions to Industry at IPC APEX EXPO 2018
IPC – Association Connecting Electronics Industries presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO 2018 at the San Diego Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.
5. Moving Compass Call Electronic Warfare System to Modern Business Jet
BAE Systems has begun work to transition its advanced Compass Call electronic warfare (EW) system from aging EC-130H aircraft to a modern, more capable platform that will significantly improve mission effectiveness.
6. Elbit Systems Wins $85 Million Contract to Supply Electronic Warfare Systems
Elbit Systems Ltd. announced today that it was awarded an approximately $85 million contract from a European country to supply a range of advanced ground-based electronic warfare (EW) and signal intelligence (SIGINT) systems. The contract will be performed over a four-year period.
7. I-Connect007 Launches Thermal Management with Insulated Metal Substrates eBook
I-Connect007 is excited to announce the release of the latest title in our micro eBook design series: The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrates.
8. Global Electronic Warfare Market to See CAGR of 6.2% from 2017-2026
The Global Electronic Warfare market is accounted for $22.19 billion in 2017 and is expected to reach $38.31 billion by 2026 growing at a CAGR of 6.2%.
9. I-Connect007 Launches Fundamentals of RF/Microwave PCBs Micro eBook
I-Connect007 is excited to announce the release of the latest title in our micro eBook design series: The Printed Circuit Designer’s Guide to… Fundamentals of RF/Microwave PCBs.
10. Benefits of Low-Temp Soldering: I-007eBook Now Available
Tired of solder joint failures? Get your head off the pillow! Learn about opportunities and solutions provided by low-temperature soldering in I-Connect007’s newest micro eBook: The Printed Circuit Assembler’s Guide to… Low-Temperature Soldering.
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Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.