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NPL Webinar on Increasing the Performance of Organic PCBs
January 3, 2019 | NPLEstimated reading time: Less than a minute
There has been an increase in the demand for high temperature interconnect solutions at circuit board level joining with recent introductions of high-power semiconductors and increased operating temperatures.
Application areas for these new devices include electric vehicles, renewable energy, avionics, and oil and gas. Reliable operation in these environments require a combination of performance improvements in components, interconnects and substrates.
In line with this, NPL’s Electronics Interconnection Group will be holding a webinar on increasing the performance of organic PCBs at higher temperatures on January 17.
This Group is internationally recognized for its practical and innovative work on lead-free reliability, PCB interconnection failures, tin whisker migration and conformal coating research. The team investigates interconnect properties and develop metrological techniques to characterize performance, frequently in multiple domains. Research is focused on the emerging technologies within printed electronics, harsh and high temperature electronics, wearable technology and electrochemical performance in coating barrier systems.
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IMI Welcomes New CEO
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05/02/2024 | IPCApril 2024 marked the third consecutive month of sentiment growth among electronics manufacturers. When asked if they expected labor costs for hourly workers to rise over the next month, manufacturers in the United States, Mexico, and Europe predicted a five percent increase, while manufacturers in Asia predicted a slightly lower four percent increase.
iNEMI Names Grace O'Malley CTO
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