-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Eltek Receives a $530,000 Bridge Loan from Nistec
January 9, 2019 | PRNewswireEstimated reading time: 1 minute
Eltek Ltd. has obtained a loan of NIS 2 million (approximately US$530,000) from Nistec Golan, the Company's controlling shareholder, in order to decrease Eltek's debt to one of its banks.
The loan agreement between the Company and Nistec was approved by the Company's Audit Committee and Board of Directors. The principal terms of the loan are:
- The loan will bear interest of Prime+ 1.35%. Since Nistec obtained a loan from a commercial bank for a repayment on behalf of Eltek, should Eltek fail to repay the loan and accrued interest on the due date, the interest shall be increased to the interest determined by the bank with respect to the underlying loan received by Nistec.
- The loan will be repaid by April 30, 2019. However, Eltek has the option to extend the term of the loan until March 31, 2020 in the event that its Audit Committee determines that such extension is required for the Company's orderly operations.
- In the event of an equity investment in the Company, Nistec may demand immediate repayment of the loan, provided that such repayment will be used only for a conversion of the loan into the Company's ordinary shares.
- Nistec may demand immediate repayment of the loan upon the occurrence of certain customary events of default or in the event of a change of control.
- The loan (or any part thereof) may be repaid at any time at the Company's discretion.
In addition, the Audit Committee and Board of Directors have approved Nistec's guarantee of Eltek's NIS 2.0 Million (approximately US$530,000) existing debt to the same bank, which debt to such bank will be repaid by Eltek by April 30, 2019. Consequently, this guarantee will expire on April 30, 2019. Eltek may request that Nistec pay its debt to the bank, and in such event, the guarantee will convert into a loan to Eltek, which will be repaid by March 31, 2020. The terms of the loan will be back-to-back with the terms of the loan taken by Nistec for such payment, or with "Risk-free" Israeli government bonds interest, or with no interest, at Nistec's discretion. The terms of the loan agreement will be the same as the terms of the loan agreement described above, with required amendments.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
TTM Technologies, Inc. Appoints Edwin Roks, Ph.D. as President and Chief Executive Officer and Member of Board of Directors
08/14/2025 | TTM TechnologiesTTM Technologies, Inc., a leading global manufacturer of technology solutions including mission systems, radio frequency (“RF”) components and RF microwave/microelectronic assemblies, quick-turn and technologically advanced printed circuit boards (“PCB”), today announced the appointment of Edwin Roks, Ph.D. as the company’s new President and Chief Executive Officer, effective September 2nd, 2025.
TTM Technologies, Inc. Announces Retirement Plans of its CEO and Proceeds with CEO Successor Search
08/04/2025 | TTM Technologies, Inc.TTM Technologies, Inc., a leading global manufacturer of technology solutions including mission systems, radio frequency (“RF”) components and RF microwave/microelectronic assemblies, quick-turn and technologically advanced printed circuit boards (“PCB”), today announced that Thomas T. Edman, the company’s President and Chief Executive Officer, intends to retire following the appointment of the company’s next President and CEO.
Ventec International Group Enters into a Fulfillment and Supply Agreement with Matrix and Launches Ventec Americas
06/09/2025 | Ventec International GroupVentec is excited to announce a new partnership with Matrix aimed at enhancing the fulfillment, value-added conversion, and distribution of PCB base materials across the North American market. This collaboration is set to significantly improve supply chain efficiency, and delivery performance for the company's North American customers.
Transom Capital, SigmaTron Announce Entry into Merger Agreement
05/22/2025 | Globe NewswireTransom Capital Group, LLC, an operationally focused middle-market private equity firm, and SigmaTron International, Inc., an electronic manufacturing services company, announced that they have entered into a merger agreement pursuant to which an affiliate of Transom will acquire the Company.
Geospace Unveils New Brand Identity Reflecting the Company’s Move into Diverse Markets
05/20/2025 | BUSINESS WIREGeospace Technologies Corporation announces a new brand identity, reflecting the company's transformation of its leadership and culture along with a redefined strategy focused on applied intelligent technology.