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From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
The Automation Advantage
In this issue, we discover how AI, machine learning, and practical factory automation are reshaping PCB fabrication, and where these tools can meaningfully move your business forward.
Thank you, Columnists
This month, we give thanks to our columnists—the brilliant minds who share their expertise, experiences, and passion for the PCB industry. Meet the people behind the pages, learn what drives them, and discover their personal stories.
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Ventec International Group Enters into a Fulfillment and Supply Agreement with Matrix and Launches Ventec Americas
June 9, 2025 | Ventec International GroupEstimated reading time: Less than a minute
Ventec is excited to announce a new partnership with Matrix aimed at enhancing the fulfillment, value-added conversion, and distribution of PCB base materials across the North American market. This collaboration is set to significantly improve supply chain efficiency, and delivery performance for the company's North American customers.
The synergies created by our partnership will benefit all of their North American customers through their enhanced Just-In-Time (JIT) and logistics model, supported by the company's five (5) rapid-response warehouses.
Starting June 9th 2025, they will offer expedited delivery of Ventec’s range of Polyimide, FR4, FR4.1 & FR15.1 materials through the Santa Ana warehouse. Over the next few months, Ventec will ramp up operations and extend expedited delivery services to additional locations, ensuring broader and faster access to our high-quality materials.
Stay tuned for updates as they continue to enhance our distribution network.
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Henger Announces Delivery of 400 Plasma Equipment Units and Launch of Their Second Plant
11/14/2025 | HengerZhuhai Henger Microelectronics Equipment Co., Ltd. announced the successful delivery of its 400th PCB plasma equipment unit and the official inauguration of the plasma workshop at its second plant on November 11. These milestones mark a significant advancement in the company’s technological development and production capacity.
PDN Optimization: Balancing Performance and Cost in SoC Designs
10/22/2025 | Zach Caprai. Siemens EDAThis article demonstrates advanced PDN optimization techniques through a real-world case study of AMD’s Versal adaptive SoC platform. Using the VCK190 evaluation kit featuring the Versal AI Core series VC1902 device, I’ll explore how effective PDN design and optimization can help meet demanding technical specifications while addressing essential business goals.
Empower Sets New Benchmark with 20x Faster Response and Breakthrough Sustainability Demonstrated at OCP Global Summit 2025
09/25/2025 | Empower SemiconductorEmpower Semiconductor, the world leader in powering AI-class processors, announced that its Crescendo chipset, an artificial intelligence (AI) and high-performance computing (HPC) processor true vertical power delivery platform, is available now for final sampling, with mass production slated for late 2025.
Advint Incorporated Brings Artificial Intelligence to Electroplating Training
09/11/2025 | Advint IncorporatedAdvint Incorporated is introducing a new dimension to its electroplating training programs: the integration of Artificial Intelligence (AI). This initiative reflects the company’s commitment to providing PCB fabricators and manufacturers in the USA and Canada with training that is practical, forward-looking, and directly relevant to today’s production challenges.
WellPCB, OurPCB Launch Low-Cost PCB Assembly and Custom Cable Assembly Solutions
05/29/2025 | ACCESSWIREWellPCB and OurPCB, world leading PCB manufacturing service providers, announced today that they have officially launched new Low-Cost PCB Assembly Solutions and Custom Cable Assembly services to meet the needs of the electronics manufacturing industry for high cost performance and flexible customization.