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Flex Ltd. Comments on IPC Executive Forum for Advancing Automotive Electronics
January 16, 2019 | Gene Weiner, Weiner International Inc.Estimated reading time: 1 minute
After reviewing the Executive Forum for Advancing Automotive Electronics program and Gene Weiner's comment about how the topics presented apply to military and flexible circuits as well as 5G needs, Dr. Joan K. Vrtis, Senior Vice President of Flex Ltd, has this to say:
"This has been a trend for the past five years with solid progress. The adoption of advancing manufacturing with Factory 4.0 principles has given way to PCB technology with 20/20 µm L/S and 200 µm pitch with 50 µm microvia copper filled and stacked to 12 layers—think ELIC or ALIVH on steroids. This allows for direct chip attach and fan in/out options for the next generation of IOT or other chipsets. SiP and modules are a significant part of the 5G solution. Advanced materials, mixed mode laser (CO2/UV) used in substrate-like feature definition, and new copper-plate via fill chemistries are adopted to standard PCBs to meet the needs of these higher density features."
It's not too late to register for this not-to-be-missed event. There will be something useful presented that will be of value to the management of every fabricator!
Registration information for the Executive Forum on Advancing Automotive Electronics is available online at www.ipcapexexpo.org.
For further information, contact Forum Chairman Gene Weiner at gene@weiner-intl.com or Tracy Riggan, senior director, IPC Member Support at TracyRiggan@ipc.org.
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