-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Flexible Circuits Adds DIS Direct Optical Registration
January 22, 2019 | Flexible Circuits Inc.Estimated reading time: 1 minute
Flexible Circuits Inc. has officially added DIS Inc’s latest rigid-flex and flex PCB technology. The RFS system went through rigorous testing not only to prove its ready for production but redundancy as well. Surpassing the expectations with RFS 001 we are also pleased to announce that RFS system 002 order was placed and will be installed come February 2019.
"With the use of DIS Inc’s RFS layup system along with Flexible Circuits extensive knowledge in lamination, new insight has been brought to material movement and artwork compensations in multi-layer PWB fabrication. The use of this system has eliminated countless variables within the layup and lamination processes to allow for layer-to-layer alignment with precision accuracy that is required in today's high reliability HDI market." Jay Sergo, director of technology, Flexible Circuits Inc.
Direct Optical Registration allows for optical alignment of PCB inner layers during the lay-up process of multi-layers and sequential build-up technology, eliminating the need tolerances and variability inherent in manually punching and pining layers prior to lamination. The aligned multi-layers are welded together with SmartWeld™, the patented coupled induction welding system developed by DIS Inc.
In addition, Direct Optical Registration provides the opportunity to utilize X-ray inspection to quantify registration of welded multi-layers prior to lamination.
Come see the RFS first hand at this year’s IPC APEX Expo, booth 704
About Flexible Circuits Inc.
Flexible Circuits, Inc. (FCI) is a world-class, Veteran owned business that designs, engineers, manufactures and does the mixed technology assembly of flexible circuitry Types I, II, III, IV. Located in Warrington, Pennsylvania, FCI has been in business for over 55 years and produces complex, high-reliability flexible circuitry and flex circuit assemblies to the military and aerospace industries. FCI produces hardware on many different platforms for systems such as radar, satellite, naval, missile and missile defense, land armament and fighter jet programs. Flexible Circuits, Inc. is a critical supplier to many of the largest military/aerospace OEM's in the world like Raytheon, BAE, Lockheed, Northrop-Grumman, DRS, Boeing, UTC, L3 and ATK/Orbital to name a few. FCI is an ISO-9001 and AS-9100 certified company with other certifications including Mil-P-50884, IPC-6013, IPC-6012, and J-STD 001.
Suggested Items
AirBorn Announces Agreement to be Acquired by Molex
11/18/2024 | PRNewswireAirBorn, a global manufacturer of high reliability electronics and components, announced it has entered into an agreement to be acquired by Molex, a leading global connectivity and electronics solutions provider.
RTX's Collins Aerospace to Provide UK Chinook Helicopters with Interoperable Avionics System
11/12/2024 | RTXCollins Aerospace, an RTX business, has received a $19 million contract from the Department of Defense to equip a fleet of new H-47 Chinooks for the UK Royal Air Force with its Common Avionics Architecture System (CAAS) avionics management suite.
Lockheed Martin Skunk Works, the Royal Netherlands Aerospace Centre (NLR) Announce Strategic Collaboration
10/21/2024 | Lockheed MartinSkunk Works®, the renowned advanced development organization within Lockheed Martin Corporation and the Royal Netherlands Aerospace Centre (NLR), a premier knowledge institute and connecting link among science, industry, and government in the Netherlands, announced a strategic collaboration to advance mutual interests for enhanced security at the Netherlands Defense Industry Days event.
Altair Drives Aerospace Innovation at Motivo
10/17/2024 | AltairAltair, a global leader in computational intelligence, is proud to announce its collaboration with Motivo, a product engineering firm focused on translating forward-thinking visions into best-in-class products for clients in the mobility, energy, agriculture technology, and aerospace sectors. Motivo utilizes Altair’s unique combination of engineering consulting and software to drive innovation for organizations in the aerospace industry.
Airbus, Toshiba to Partner on Superconductivity Research
10/16/2024 | AirbusAirbus UpNext, a wholly-owned subsidiary of Airbus, and Toshiba Energy Systems & Solutions Corporation (Toshiba), Toshiba Group’s energy arm, will cooperate and mutualise experience on superconducting technologies for future hydrogen-powered aircraft.