-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
IPC Issues Warning on Microvia Reliability for High Performance Products
March 7, 2019 | IPCEstimated reading time: 3 minutes
The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products. A number of IPC OEM member companies have approached IPC with examples of microvia failures in high-profile hardware that were not observed until after bare printed board fabrication, inspection and acceptance, including:
- Post-reflow in-circuit test
- During “box level” assembly environmental stress screening (ESS)
- In service (end customer-fielded product)
Many of these failures occurred within products that had already passed traditional production lot acceptance testing in accordance with existing IPC-6010, Printed Board Qualification and Performance Specifications. IPC has been provided with data showing that traditional inspection techniques utilizing thermally stressed microsections and light microscopes alone is no longer an effective quality assurance tool for detecting microvia-to-target plating failures.
Related to this, in 2018, IPC released IPC-WP-023, an IPC Technology Solutions White Paper on Performance-Based Printed Board OEM Acceptance titled “Via Chain Continuity Reflow Test: The Hidden Reliability Threat—Weak Microvia Interface.” The white paper asserts stacked microvia reliability problems linked to a weak interface between microvia target pads and electrolytic copper fill and provides data in support of the observations reported by numerous IPC OEM member companies.
As a result of IPC-WP-023, the IPC V-TSL-MVIA Weak Interface Microvia Failures Technology Solutions Subcommittee was formed in late 2018 to begin investigating the potential causes of these failures and to provide industry resources on the topic. This group provided its first update to industry during an open forum held during IPC APEX EXPO 2019 and will continue to provide updates as it progresses.
In response to this, IPC is issuing the following warning statement, which will also be included in the forthcoming IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards:
“There have been many examples of post fabrication microvia failures over the last several years. Typically, these failures occur during reflow, however they are often undetectable (latent) at room temperature. The further along the assembly process that the failures manifest themselves the more expensive they become. If they remain undetected until after the product is placed into service, they become a much greater cost risk, and more importantly, may pose a safety risk.”
Looking forward, IPC is working on the concept of moving away from traditional microsection evaluations and focusing on performance-based acceptance testing, a recommendation made several years ago by the IPC D-33a Rigid Printed Board Performance Task Group responsible for the IPC-6012 specification. In conjunction with this task group and the IPC 1-10c Test Coupon and Artwork and Generation Task Group and D-32 Thermal Stress Test Methodology Subcommittee, IPC continues to work on revisions to its existing test methods for thermal stress (IPC-TM-650, Method 2.6.27) and thermal shock (IPC-TM-650, Method 2.6.7.2). These methodologies make use of performance-based acceptance test coupons utilizing electrical resistance measurements, such as the IPC-2221B Appendix “D” coupon, which when designed properly in accordance with the IPC-2221B Gerber Coupon Generator tool, have allowed manufacturers to detect latent microvia failures and shelter themselves from possible defect escapes.
About IPC
IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 5,000 member-company sites which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Brent Laufenberg Appointed CIO of the Global Electronics Association, Advancing Technology and Member Services
07/31/2025 | Global Electronics AssociationThe Global Electronics Association (formerly IPC International Inc.) announces the appointment of Brent Laufenberg as its new Chief Information Officer (CIO).
Direct Metallization: A Sustainable Shift in PCB Fabrication
07/31/2025 | Jim Watkowski, Harry Yang, and Mark Edwards, MacDermid Alpha Electronics SolutionsThe global electronics industry is undergoing a significant transformation, driven by the need for more resilient supply chains and environmentally sustainable manufacturing practices. Printed circuit boards (PCBs), the backbone of interconnection for electronic devices, are at the center of this shift. Traditionally, PCB fabrication has relied heavily on electroless copper, a process that, while effective, is resource-intensive and environmentally hazardous. In response, many manufacturers are turning to direct metallization technologies as a cleaner, more efficient alternative.
MacDermid Alpha Electronics Solutions Unveils Unified Global Website to Deepen Customer, Talent, and Stakeholder Engagement
07/31/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronics Solutions, the electronics business of Elements Solutions Inc, today launched macdermidalpha.com - a unified global website built to deepen digital engagement. The launch marks a significant milestone in the business’ ongoing commitment to delivering more meaningful, interactive, and impactful experiences for its customers, talent, and stakeholders worldwide.
Considering the Future of Impending Copper Tariffs
07/30/2025 | I-Connect007 Editorial TeamThe Global Electronics Association is alerting industry members that a potential 50% tariff on copper could hit U.S. electronics manufacturers where it hurts.
Foxconn, TECO Announce Strategic Alliance Targeting AI Data Center Capabilities
07/30/2025 | PRNewswireHon Hai Technology Group (Foxconn) and TECO Electric & Machinery Co Ltd Ltd (TECO) on Wednesday announced a share exchange, strategic alliance that will strengthen their AI infrastructure capabilities and propel the two Taiwanese tech majors into key markets in the global super-computing race.