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April 2019 Issue of SMT007 Magazine Available Now
April 1, 2019 | I-Connect007Estimated reading time: Less than a minute
In our industry, the sheer number of new technologies in development will change not only what our industry builds but how we build it. And the youth coming up behind us are perfectly willing to make use of these new technologies. It's not a brave new world; it is a courageous new world. Apparently, no one told these young people that it couldn’t be done.
In this month's issue of SMT007 Magazine, we continue the discussion on the next generation of leaders in electronics manufacturing, bringing you a taste of who will be filling your shoes, and what they’ll be bringing with them.
Read the April 2019 issue of SMT007 Magazine, now on the virtual newsstand, and available for delivery in your e-mailbox by subscribing here.
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05/02/2024 | I-Connect007In “PCB 3.0: A New Design Methodology—SI/PI for PCB Designers,” subject matter expert Brad Griffin, Cadence Design Systems, discusses how an intelligent system design methodology can move some signal and power integrity decision-making into the physical design space, offering real-time feedback.
The New Industry: Will the Growth Continue?
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TTM’s High Tech Expansion and Industry Innovation
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U.S. Companies Invest Heavily in Robots
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