Dan’s Biz Bookshelf: ‘Believe in Better'
The Big Picture: Our Big ‘Why’ in the Age of AI
The Chemical Connection: Through-glass Vias in Glass Substrates
Call for Participation: IPC Electronics Materials Forum 2019
April 4, 2019 | IPCEstimated reading time: 1 minute
IPC invites you to present at the upcoming IPC Electronics Materials Forum to be held on November 5–7, 2019.
This new technical conference will focus on developments in materials and processes associated with advanced electronics assembly and manufacturing. Materials enable advancement because it is possible to envision many future technologies, but they will never be fully realized without the materials and processes to manufacture them.
The content will focus on materials for board fabrication, assembly, and post-assembly protection. The over-arching theme of emerging technologies that challenge our existing materials set will inform attendees on developments needed for the future. Interactive panels will also extend an open forum to discuss solutions to these challenges.
Seeking presentations on emerging technologies challenging existing material sets.
Other topics of interest include:
Substrate Materials:
- Novel board laminates
- Surface finishes
- Solder mask advancements
- Flexible/wearable circuits
- HDI developments
Assembly Materials:
- New solder alloys
- Flux development
- Cleaning chemistries
- Assembly process strategies
- Thermal interface solutions
Protective Materials:
- Cleaning chemistries
- Conformal coatings
- Adhesives
- Underfills
Who Should Attend?
Engineers and managers that procure materials or qualify materials, or want to understand advancements in materials for the board, assembly, components, and protective layers: process engineers, manufacturing managers, materials scientists, SMT line managers, quality managers (for materials or failure analysis).
Please send title and short description to Brook Sandy-Smith, IPC technical education program manager, at BrookSandy@ipc.org by June 28, 2019.
Share on:
Suggested Items
Incap Estonia Recognized with Second Golden Label for Responsible Business
06/27/2025 | IncapIncap Electronics Estonia has been awarded a golden label by the Responsible Business Forum in Estonia for the second time. The responsible business label is a prestigious symbol in Estonia that identifies entrepreneurs and organisations that demonstrate excellence in environmental, social, and economic responsibility.
TRI Unveils New Multi-Camera AOI, TR7500 SIII Ultra
06/27/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces the new TR7500 SIII Ultra.
TT Electronics Achieves ISO 13485 Medical Certification at Mexicali EMS Facility
06/27/2025 | TT ElectronicsThis milestone underscores TT Electronics’ commitment to delivering high-quality, compliant, and reliable manufacturing solutions to its global customers in healthcare and life sciences.
PCBA Market to Reach $147.5 Billion by 2035, Growing at a CAGR of 4.7% from 2025
06/27/2025 | PRNewswireThe Printed Circuit Board Assembly market is projected to reach $147.5 billion by 2035, up from an estimated $90.91 billion in 2025, growing at a steady CAGR of 4.7% during the forecast period.
Scanfil Strengthens its Customer Portfolio in Medtech & Life Science by Signing Agreement with Liquid Instruments
06/27/2025 | BUSINESS WIREScanfil and Liquid Instruments have signed a manufacturing outsourcing agreement for Scanfil’s Melbourne plant in Australia. This agreement supports Liquid Instruments’ strategy to onshore production of its flagship Moku platform, strengthening domestic supply chains and bringing manufacturing closer to its research and development hub.