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Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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April 17: IPC Webinar on Weak Interface/Stacked Microvia Reliability
April 12, 2019 | IPCEstimated reading time: Less than a minute
For the upcoming IPC Wisdom Wednesday Webinar on April 17, the topic will be on weak interface/stacked microvia reliability concerns, to be presented by Dennis Fritz, IPC V-TSL-MVIA Co-Chair. The webinar is scheduled for 10:00–10:45 am CDT.
IPC has issued an industry warning on microvia reliability for high performance products. A number of IPC OEM member companies have presented examples of microvia failures that were not observed until after bare printed board fabrication, inspection and acceptance.
This free webinar will discuss why IPC has issued this warning and will provide an overview of this problem, with examples of the different conditions of concern. It will also cover how IPC has organized to address the problem, including sub-teams formed earlier this year at IPC APEX EXPO.
To gain a deeper understanding of this issue and how it may impact the design and testing of bare boards, register today by clicking here.
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A.R.T. Ltd. Nominated in Four Categories at 2025 Instrumentation and Electronics Industry Awards
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