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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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The April 2019 Edition of FLEX007 Magazine Now Available
April 22, 2019 | I-Connect007Estimated reading time: Less than a minute

The April 2019 issue of FLEX007 Magazine is now available for download.
How does one start with the concept and design of a flex circuit and get to the final product, especially when that product is pushing the limits of technology, is an unusual shape, has a short time-to-market, or all of the above? We have articles and columns to help with that, but the main takeaway is: Team up with your supplier and customer and work together for the optimal solution. Plus, in this issue you’ll learn more about 3D printing and how it fits with flex.
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Robotas Technologies Champions Innovation in Through-Hole Assembly with Mascot and VERIFY Systems
06/13/2025 | Robotas Technologies Ltd.While Surface Mount Technology (SMT) dominates today’s electronics manufacturing headlines, Robotas Technologies Ltd. continues to lead the charge in advancing Through-Hole Technology (THT) assembly.
Enough Talk—Time to Strengthen America’s Microelectronics Industrial Base
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