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The Knowledge Base: A CM’s Perspective on Box Build Practices

04/30/2024 | Mike Konrad -- Column: The Knowledge Base
In the ever-evolving landscape of electronics manufacturing, the box-build process stands out as a critical phase that bridges the gap between individual component manufacturing and the delivery of a fully functional electronic system. This intricate procedure, encompassing the assembly of everything from PCBs to wire harnesses and mechanical enclosures, demands a high level of precision, efficiency, and innovation. As the electronics assembly industry expands and diversifies, understanding the best practices within box-build assembly has become paramount for manufacturers aiming to stay ahead in a competitive market.

RTX's Raytheon Awards Contract to Spain's Sener for Missile Production Support

04/30/2024 | RTX
Raytheon, an RTX business, has awarded Spanish supplier, Sener, a contract to develop and produce the electro-mechanical control section of the Patriot® GEM-T missile.

Samsung Electronics Begins Industry’s First Mass Production of 9th-Gen V-NAND

04/29/2024 | Samsung Electronics
Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass production for its one-terabit (Tb) triple-level cell (TLC) 9th-generation vertical NAND (V-NAND), solidifying its leadership in the NAND flash market.

Peters’ ELPEGUARD SL 1800 FLZ Now Also Certified for Outdoor Applications

04/29/2024 | Peters
The conformal coating ELPEGUARD® SL 1800 FLZ from Peters has been awarded an extended UL certificate. The UL 746 E rating certifies that the acrylate-based coating for printed circuit boards, besides featuring the highest non-flammability rating UL V-0, is also suitable for outdoor use.

TSMC Celebrates 30th North America Technology Symposium

04/29/2024 | TSMC
TSMC unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company’s 2024 North America Technology Symposium.
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